Dongming He(. Vrije U., Brussels. ) ORCID · 2022-present. PHD, Vrije U., Brussels · 2020-2022. MASTER, Amsterdam U. · 2016-2020. UNDERGRADUATE, USTC, Hefei.

About Wafer level passivation/PI/RDL/bump/ubump/BE2 process development and NPI 2.5D/3D. Experience Qualcomm Graphic Qualcomm Greater San Diego Area

He is a Staff Silicon and Package Integration Engineer at Intel Corporation, Chandler, AZ. His research experience and interests include thermo–mechanical ...

Dongming He, Research Teaching Specialist, V CABM, 213 Valvezan Lab, hedo@cabm.rutgers.edu, Center for Advanced Biotechnology and Medicine.

Dongming He · High Energy Physics · PhD, Faculty of Sciences and Bioengineering Sciences · Doctoral scholarschip, Physics.

No information is available for this page. · Learn why

Dongming He's 9 research works with 1357 citations, including: Pin1 Promotes Transforming Growth Factor- -induced Migration and Invasion.

Dongming He · Graduated from University of Amsterdam / Universiteit van Amsterdam · Started New Job at VUB - Vrije Universiteit Brussel · Started School at ...

Publication Topics. Failure Mechanism,Failure Modes,Shear Stress,3D Integration,Additional Barriers,Aging Temperature,Aluminum Pads,Back-end-of-line,Barrier ...