Implementing 3D IC is to integrate 2D ICs with Through-Silicon Vias (TSVs). For yield consideration, TSVs are bundled together as a TSV block [1]. Regrettably, ...
We propose a buffer insertion algorithm that further reduces delay by considering slew explicitly. Compared with the well-known van Ginneken algorithm and a ...
Analyzing the impact of TSV size and placement on the interconnect timing performance and signal integrity, this paper presents an approach for TSV insertion in ...
This paper investigates the multiple TSV-to-TSV coupling issue and proposes an accurate model that can be efficiently used for full-chip extraction.
ABSTRACT. This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model.
Yen-Hao Chen, Po-Chen Huang, Fu-Wei Chen, Allen C.-H. Wu, TingTing Hwang: Crosstalk-aware TSV-buffer Insertion in 3D IC. SoCC 2019: 400-405.
TSV-aware interconnect length and power prediction for 3D stacked ICs
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In this paper, we present a new 3D wirelength distribution model which considers the contribution of through-silicon-via (TSV) on wirelength, die area, ...
This paper proposes a detailed placement algorithm called nonuniform-scaling-based placement to optimize the dynamic power consumption of multitier gate-level ...
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that ...
Nov 27, 2018 · In 3D IC clock, TSV insertion may induce side effects in the current design and manufacturing process, such as thermal problem, mechanical ...