In this paper, we first introduce the passive interconnection composed of TSV/RDL and their equivalent circuit model. Then, we use a compact modeling method to ...
To investigate the formation of one kind of typical inter-dendritic crack around triple point region in continuous casting(CC) slab during the operation of soft ...
Abstract—High bit rate, high density, low power consumption, low voltage and high current are among the major features and demands of today's high-speed ...
Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. Student Contest: No. Affiliation Type: Academia.
Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. ICTA 2021: 65-68. [+][–]. 2010 – 2019. FAQ. see FAQ.
3D stacking technology places multiple chips vertically, while silicon chips are stacked side-by-side on a silicon interposer layer in the 2.5D stacking ...
Abstract—Chiplet has recently emerged as a promising solution to achieving further performance improvements by breaking down complex processors into modular ...
This section describe the all digital high speed D2D PHY for links on 2.5D silicon interposer, where design agility and energy efficiency are both emphasized.
Missing: Typical | Show results with:Typical
Active interposers provide interconnections between chiplets, and connections to the substrate through TSVs, but they also include active circuitry built into ...
Missing: Compact Modeling Inter- Serial
Jun 28, 2021 · significant advancement in 2.5D integrated circuits, where chiplets are integrated on a silicon interposer or a package.
Missing: Compact | Show results with:Compact