This paper presents an efficient on-chip 3D-IC test framework that can embed the test procedure of TSVs into the memory BIST process.
This paper presents an efficient on-chip 3D-IC test framework that can embed the test procedure of TSVs into the memory BIST process. By using the same test ...
Apr 26, 2019 · The proposed BIST design is distributed, reusable, and reconfigurable, hence it is attractive for both pre-bond and post-bond testing. We also ...
Feb 3, 2023 · An end-to-end design of a built-in self-test (BIST) infrastructure for 3D-stacked ICs that facilitate the use of BIST at multiple stages of 3D integration.
An end-to-end design of a built-in self-test (BIST) infrastructure for 3D-stacked ICs that facilitate the use of BIST at multiple stages of 3D integration.
To provide an on-chip 3D system that allows the identification of multiple failures in a group of TSVs without compromising performance.
Feb 1, 2017 · The core components of 3-D ICs are through-silicon vias (TSVs), which should pass appropriate prebond and post-bond tests in 3-D IC fabrication ...
An efficient 3D-IC on-chip test framework to embed TSV testing in memory BIST ... This paper presents an efficient on-chip 3D-IC test framework that can ...
Feb 10, 2023 · This paper proposes a novel technique of TSV BIST repair that targets the design yield and various test challenges of three-dimensional integrated circuits (3D ...
Missing: framework | Show results with:framework
This paper provides an overview of 3D stacked ICs and their emerging solutions, categorized in the areas of test flows, test contents, and (3) test access.
Missing: embed | Show results with:embed