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Abstract: As integrated circuit technology improvements result in increased device speed, designers are forced to adopt new forms of packaging and ...
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Figure 2: A sketch of an Optical Multichip Module (OMCM): electo-optic devices are flip-chip bump bonded onto a transparent substrate.
A description is given of how planar optical interconnect techniques may be combined with a multichip module process to provide optical interconnect within the ...
A comparative analysis of short- and long-wavelength multi-chip optical transmitter modules for optical PCBs applications · Engineering, Physics. OPTO · 2009.
Development of a Multichip Module DSP. The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. · A ...
We have integrated an 850-nm VCSEL, its driver, and diffractive lenslet array onto a single substrate to produce an integrated opto-electronic multi-chip module ...
A multi chip package device combines the functions of multiple LEDs or combining it with the capabilities of a photodiode to create a versatile device.
A multi-chip module is the earliest form of a system-in-package, adding two or more integrated circuits to a common base and a single package.
Multichip modules (MCM) are basically extensions of hybrid microcircuits, the differences being in their higher degree of density and improved electrical ...
Aug 28, 2020 · Our four-channel transceiver provides the electro-optic interface between electrical data generation and photonic switching to enable ...