In this study, a multi-scale approach was developed to study delamination in a bi-material structure, which bridge molecular dynamics method and finite element ...
The present study is focused on incorporating material behavior at the interface derived from MD simulations into the continuum model. The MD simulations were ...
A multiscale approach for investigation of interfacial delamination in ...
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Abstract. Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design.
Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package.
A multiscale approach for investigation of interfacial ...
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Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package.
A multi-scale model was built to determine the interfacial strain energy density between the EMC and copper substrate. The concept of virtual internal bond (VIB) ...
In this study, a multiscale approach was proposed to study delamination in a bi-material structure, which bridge molecular dynamics method and finite ...
A multi-scale method to investigate delamination in electronic packages. https://doi.org/10.1163/156856106777890608. Journal: Journal of Adhesion Science ...
A multiscale approach for investigation of interfacial delamination in electronic packages. Author(s): Fan, Haibo; Yuen,Matthew Ming Fai 2009; A multiscale ...
In this study, a multiscale approach was proposed to study delamination in a bi-material structure, which bridge molecular dynamics method and finite ...