A 6.5×6.5 mm 2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data ...
A 6.5×6.5 mm2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data ...
The folded dipole antenna with a reflector on PCB have shown suitable properties, which make silicon a competitive substrate for antenna integration and ...
A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), ...
A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), ...
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. 2013 IEEE International 3D Systems Integration Conference ...
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. Y Lamy, L Dussopt, O El Bouayadi, C Ferrandon, A Siligaris ...
Vincent, “A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications,” IEEE. International 3D Systems Integration ...
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. Y Lamy, L Dussopt, O El Bouayadi, C Ferrandon, A Siligaris ...
Lamy, A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications, с. 1; Ebefors, The development and evaluation of RF ...