Nov 26, 2014 · Abstract: Recent advances on hybrid III–V/Si lasers and semiconductor optical amplifiers using wafer bonding are reported.
scholar.google.com › citations
Abstract: Recent advances on hybrid III-V/Si lasers and semiconductor optical amplifiers using a wafer bonding technique are reported.
Recent advances on hybrid III–V/Si lasers and semiconductor optical amplifiers using wafer bonding are reported. Hybrid optical amplifiers exhibit 28 dB ...
Abstract—Recent advances on hybrid III–V/Si lasers and semi- conductor optical amplifiers using wafer bonding are reported.
Heterogeneous integration of III-V on silicon proposed by Duan et al was evidenced to be an effective way to fabricate laser sources on silicon whose ...
Dec 16, 2014 · Recent advances on hybrid III-V/Si lasers and semiconductor optical amplifiers using a wafer bonding technique are reported.
This paper reviews the prevalent methods for heterogeneous integration and recent advancements in the integration of silicon and III-V semiconductor lasers ...
Abstract. Silicon (Si) photonics is a disruptive technology on the fast track to revolutionise integrated photonics. An.
In this review paper, recent demonstrated heterogeneous integration of III–V lasers on Si will be presented with a special focus on direct/adhesive bonding ...
Recent advances on hybrid III-V/Si lasers and semiconductor optical amplifiers using wafer bonding are reported. Hybrid optical amplifiers exhibit 28 dB ...