End-to-End Deep Learning by MCU Implementation: An Intelligent Gripper for Shape Identification
<p>The candidate objects.</p> "> Figure 2
<p>STFT-CNN for shape identification.</p> "> Figure 3
<p>Illustration of convolutional operation.</p> "> Figure 4
<p>Max pooling operation illustration.</p> "> Figure 5
<p>Illustration of autoencoder, (<b>a</b>) autoencoder for feature extraction; (<b>b</b>) autoencoder-NN for classification.</p> "> Figure 6
<p>Training and testing results of AE.</p> "> Figure 7
<p>System description of the proposed system, (<b>a</b>) system diagram; (<b>b</b>)The detailed positions of accelerometer installation of jaws.</p> "> Figure 8
<p>The realization of the proposed system.</p> "> Figure 9
<p>The acceleration voltage signals for no gripping.</p> "> Figure 10
<p>The acceleration voltage signals cylinder gripping, (<b>a</b>) large one; (<b>b</b>) small one.</p> "> Figure 10 Cont.
<p>The acceleration voltage signals cylinder gripping, (<b>a</b>) large one; (<b>b</b>) small one.</p> "> Figure 11
<p>FFT analysis of cylinder gripping signal, (<b>a</b>) large one; (<b>b</b>) small one.</p> "> Figure 12
<p>The STFT result for gripping small-cylinder, (<b>a</b>) large one; (<b>b</b>) small one.</p> "> Figure 13
<p>Training and testing results.</p> "> Figure 14
<p>STFT input feature and activation map for (<b>a</b>) large-cylinder, (<b>b</b>) large-square column, (<b>c</b>) large-hexagonal column, (<b>d</b>) small-cylinder, (<b>e</b>) small-square column, and (<b>f</b>) small-hexagonal column.</p> "> Figure 15
<p>Illustration of the effect of object location.</p> "> Figure 16
<p>Acceleration signals of different locations for a large hexagon: (<b>a</b>) rear, middle; (<b>b</b>) middle, middle.</p> "> Figure 17
<p>Training and testing results for location variation.</p> "> Figure 18
<p>Combination of STFT-CNN and AE in parallel scheme.</p> ">
Abstract
:1. Introduction
2. Identification Approach by Deep Learning
2.1. Signal Prepocessiong
2.2. Convolution Neural Network
2.3. Autoencoder
2.4. Hyperparameter Optimization
3. End-to-End Implementation by the MCU
3.1. System Description
3.2. Experimental Results and Discussion
3.2.1. Experiment 1: Performance of STFT-CNN
3.2.2. Experiment 2: Discussion on Location Variation of Objects
3.2.3. Experiment 3: Discussion for Classifying Other Objects
3.2.4. Experiment 4: Discussion for Thickness of Objects
3.2.5. Experiment 5: Performance Discussion of Network Structure in MCU
4. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
- Batsuren, K.; Yun, D. Soft Robotic Gripper with Chambered Figures for Performing In-hand Manupulation. Appl. Sci. 2019, 9, 2967. [Google Scholar] [CrossRef] [Green Version]
- Chen, Q.; Zhang, C.; Ni, H.; Liang, X.; Wang, H.; Hu, T. Trajectory Planning Method for Robot Sorting System based on S-shaped Acceleration/deceleration Algorithm. Int. J. Adv. Robot. Syst. 2018, 15. [Google Scholar] [CrossRef] [Green Version]
- Hung, C.W.; Jiang, J.G.; Wu, H.H.P.; Mao, W.L. An Automated Optical Inspection system for a tube inner circumference state identification. J. Robot. Netw. Artif. Life 2018, 4, 308–311. [Google Scholar] [CrossRef] [Green Version]
- Li, W.T.; Hung, C.W.; Chen, C.J. Tube Inner Circumference State Classification Using Artificial Neural Networks, Random Forest and Support Vector Machines Algorithms to Optimize. In International Computer Symposium; Springer: Singapore, 2018. [Google Scholar]
- Joshi, K.D.; Surgenor, B.W. Small Parts Classification with Flexible Machine Vision and a Hybrid Classifier. In Proceedings of the 2018 25th International Conference on Mechatronics and Machine Vision in Practice (M2VIP), Stuttgart, Germany, 20–22 November 2018; pp. 1–6. [Google Scholar]
- Rahim, I.M.A.; Mat, F.; Yaacob, S.; Siregar, R.A. Classifying material type and mechanical properties using artificial neural network. In Proceedings of the 2011 IEEE 7th International Colloquium on Signal Processing and its Applications, Penang, Malaysia, 4–6 March 2011; pp. 207–211. [Google Scholar]
- Kiwatthana, N.; Kaitwanidvilai, S. Development of smart gripper for identi-cation of grasped objects, in Asia–Pacific Signal and Information Processing Association. In Proceedings of the 2014 Annual Summit and Conference (APSIPA) (IEEE, 2014), Chiang Mai, Thailand, 9–12 December 2014; pp. 1–5. [Google Scholar]
- Liu, H.; Song, X.; Bimbo, J.; Seneviratne, L.; Althoefer, K. Surface material recognition through haptic exploration using an intelligent contact sensing finger. In Proceedings of the 2012 IEEE/RSJ International Conference on Intelligent Robots and Systems, Vilamoura, Portugal, 7–12 October 2012; pp. 52–57. [Google Scholar] [CrossRef]
- Drimus, A.; Kootstra, G.; Bilberg, A.; Kragic, D. Classification of rigid and deformable objects using a novel tactile sensors. In Proceedings of the 2011 15th International Conference on Advanced Robotics (ICRA), Tallinn, Estonia, 20–23 June 2011. [Google Scholar]
- Shibata, M.; Hirai, S. Soft object manipulation by simultaneous control of motion and deformation. In Proceedings of the 2006 IEEE International Conference on Robotics and Automation (ICRA), Orlando, FL, USA, 15–19 May 2006. [Google Scholar]
- Wang, C.C.; Lee, C.W.; Ouyang, C.S. A machine-learning-based fault diagnosis approach for intelligent condition monitoring. In Proceedings of the 2010 International Conference on Machine Learning and Cybernetics, Qingdao, China, 11–14 July 2010; pp. 2921–2926. [Google Scholar]
- Hung, C.W.; Li, W.T.; Mao, W.L.; Lee, P.C. Design of a Chamfering Tool Diagnosis System Using Autoencoder Learning Method. Energies 2019, 12, 3708. [Google Scholar] [CrossRef] [Green Version]
- Vununu, C.; Kwon, K.R.; Lee, E.J.; Moon, K.S.; Lee, S.H. Automatic Fault Diagnosis of Drills Using Artificial Neural Networks. In Proceedings of the 2017 16th IEEE International Conference on Machine Learning and Applications (ICMLA), Cancun, Mexico, 18–21 December 2017; pp. 992–995. [Google Scholar]
- Birlasekaran, S.; Ledwich, G. Use of FFT and ANN techniques in monitoring of transformer fault gases. In Proceedings of the 1998 International Symposium on Electrical Insulating Materials, 1998 Asian International Conference on Dielectrics and Electrical Insulation, 30th Symposium on Electrical Insulating Ma, Toyohashi, Japan, 30 September 1998; pp. 75–78. [Google Scholar]
- Liang, J.S.; Wang, K. Vibration Feature Extraction Using Audio Spectrum Analyzer Based Machine Learning. In Proceedings of the 2017 International Conference on Information, Communication and Engineering (ICICE), Xiamen, China, 17–20 November 2017; pp. 381–384. [Google Scholar]
- Hershey, S.; Chaudhuri, S.; Ellis, D.P.W.; Gemmeke, J.F.; Jansen, A.; Moore, R.C.; Plakal, M.; Platt, D.; Saurous, R.A.; Seybold, B.; et al. CNN architectures for large-scale audio classification. In Proceedings of the 2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), New Orleans, LA, USA, 5–9 March 2017; pp. 131–135. [Google Scholar]
- Siwek, K.; Osowski, S. Autoencoder versus PCA in face recognition. In Proceedings of the 2017 18th International Conference on Computational Problems of Electrical Engineering (CPEE), Kutna Hora, Czech Republic, 11–13 September 2017; pp. 1–4. [Google Scholar]
- Almotiri, J.; Elleithy, K.; Elleithy, A. Comparison of autoencoder and Principal Component Analysis followed by neural network for e-learning using handwritten recognition. In Proceedings of the 2017 IEEE Long Island Systems, Applications and Technology Conference (LISAT), Farmingdale, NY, USA, 5 May 2017; pp. 1–5. [Google Scholar]
- Zhang, Z.; Cao, S.; Cao, J. fault diagnosis of servo drive system of CNC machine based on deep learning. In Proceedings of the 2018 Chinese Automation Congress (CAC), Xi’an, China, 30 November–2 December 2018; pp. 1873–1877. [Google Scholar]
- Qu, X.Y.; Peng, Z.; Fu, D.D.; Xu, C. Autoencoder-based fault diagnosis for grinding system. In Proceedings of the 2017 29th Chinese Control and Decision Conference (CCDC), Chongqing, China, 28–30 May 2017; pp. 3867–3872. [Google Scholar]
- Xiao, Q.; Si, Y. Human action recognition using autoencoder. In Proceedings of the 2017 3rd IEEE International Conference on Computer and Communications (ICCC), Chengdu, China, 13–16 December 2017; pp. 1672–1675. [Google Scholar]
- Fournier, Q.; Aloise, D. Empirical Comparison between Autoencoders and Traditional Dimensionality Reduction Methods. In Proceedings of the 2019 IEEE Second International Conference on Artificial Intelligence and Knowledge Engineering (AIKE), Sardinia, Italy, 3–5 June 2019; pp. 211–214. [Google Scholar] [CrossRef]
- Nair, B.J.B.; Adith, C.; Saikrishna, S. A comparative approach of CNN versus auto encoders to classify the autistic disorders from brain MRI. Int. J. Recent Technol. Eng. 2019, 7, 144–149. [Google Scholar]
- Zhong, D.; Guo, W.; He, D. An Intelligent Fault Diagnosis Method based on STFT and Convolutional Neural Network for Bearings under Variable Working Conditions. In Proceedings of the 2019 Prognostics and System Health Management Conference (PHM-Qingdao), Qingdao, China, 25–27 October 2019; pp. 1–6. [Google Scholar] [CrossRef]
- Benkedjouh, T.; Zerhouni, N.; Rechak, S. Deep Learning for Fault Diagnosis based on short-time Fourier transform. In Proceedings of the 2018 International Conference on Smart Communications in Network Technologies (SaCoNeT), El Oued, Algeria, 27–31 October 2018; pp. 288–293. [Google Scholar] [CrossRef]
- Duan, S.; Zheng, H.; Liu, J. A Novel Classification Method for Flutter Signals Based on the CNN and STFT. Int. J. Aerosp. Eng. 2019, 2019, 8. [Google Scholar] [CrossRef]
- Huang, J.; Chen, B.; Yao, B.; He, W. ECG Arrhythmia Classification Using STFT-Based Spectrogram and Convolutional Neural Network. IEEE Access 2019, 7, 92871–92880. [Google Scholar] [CrossRef]
- Bergstra, J.; Bengio, Y. Random search for hyper-parameter optimization. J. Mach. Learn. Res. 2012, 13, 281–305. [Google Scholar]
- Yuanyuan, S.; Yongming, W.; Lili, G.; Zhongsong, M.; Shan, J. The comparison of optimizing SVM by GA and grid search. In Proceedings of the 2017 13th IEEE International Conference on Electronic Measurement & Instruments (ICEMI), Yangzhou, China, 20–22 October 2017; pp. 354–360. [Google Scholar]
- Caon, D.R.S.; Amehraye, A.; Razik, J.; Chollet, G.; Andreäo, R.V.; Mokbel, C. Experiments on acoustic model supervised adaptation and evaluation by K-Fold Cross Validation technique. In Proceedings of the 2010 5th International Symposium On I/V Communications and Mobile Network, Rabat, Morocco, 30 September–2 October 2010; pp. 1–4. [Google Scholar]
- Wu, X.X.; Liu, J.G. A New Early Stopping Algorithm for Improving Neural Network Generalization. In Proceedings of the 2009 Second International Conference on Intelligent Computation Technology and Automation, Changsha, China, 10–11 October 2009; pp. 15–18. [Google Scholar]
- Shao, Y.; Taff, G.N.; Walsh, S.J. Comparison of Early Stopping Criteria for Neural-Network-Based Subpixel Classification. IEEE Geosci. Remote Sens. Lett. 2011, 8, 113–117. [Google Scholar] [CrossRef]
- Ertam, F.; Aydın, G. Data classification with deep learning using Tensorflow. In Proceedings of the 2017 International Conference on Computer Science and Engineering (UBMK), Antalya, Turkey, 5–8 October 2017; pp. 755–758. [Google Scholar] [CrossRef]
- Renesas Electronics. “RX65N Group, RX651 Group Datasheet”, RX65N Datasheet. Available online: https://www.renesas.com/us/en/document/dst/rx65n-group-rx651-group-datasheet (accessed on 30 June 2019).
- e-AI Solution e-AI Translator Tool. Available online: https://www.renesas.com/jp/en/solutions/key-technology/e-ai.html (accessed on 20 August 2020).
- Freescale Semiconductor. ±1.5 g, ±6 g Three Axis Low-g Micromachined Accelerometer. MMA7361L Technical Data. 2008. Available online: http://www.freescale.com/files/sensors/doc/data_sheet/MMA7361L.pdf (accessed on 10 October 2015).
- Selvaraju, R.R.; Cogswell, M.; Das, A.; Vedantam, R.; Parikh, D.; Batra, D. Grad-CAM: Visual Explanations from Deep Networks via Gradient-Based Localization. Int. J. Comput. Vis. 2019, 128, 336–359. [Google Scholar] [CrossRef] [Green Version]
- Chen, H.Y.; Lee, C.H. Vibration Signals Analysis by Explainable Artificial Intelligence (XAI) Approach: Application on Bearing Faults Diagnosis. IEEE Access 2020, 8, 134246–134256. [Google Scholar] [CrossRef]
Hyperparameters | GS Range Setting |
---|---|
CNN channel | 2, 4, 8 |
CNN kernel | 3, 5 |
CNN filter step | 1, 2 |
Max pool use | Use or not |
ANN hidden layer | 1, 2 |
ANN layer number | 64, 128 |
Item | Rank | ||||
---|---|---|---|---|---|
1 | 2 | 3 | 4 | 5 | |
CNN channel | 2-4-4-4 | 2-4-4-8 | 2-4-4-8 | 2-4-8-8 | 2-4-4-2 |
CNN filter step | 2 | 2 | 2 | 2 | 1 |
CNN kernel | 5 | 5 | 5 | 5 | 5 |
Max pool use | Not use | Not use | Not use | Not use | Use |
ANN hidden layer | 2 | 2 | 1 | 1 | 1 |
ANN layer number | 128 | 64 | 128 | 64 | 128 |
ROM/RAM (Kbyte) | 80.4/16.1 | 32/15.6 | 25.5/15.6 | 20.5/16.3 | 11.1/26.8 |
MAC | 45.6 k | 34.6 k | 32.9 k | 38.5 k | 92.6 k |
AVG ACC | 99.72% | 99.62% | 99.54% | 99.5% | 99.49% |
AE Zoom | AE Hidden Layer | ANN Hidden Layer | ANN Size |
---|---|---|---|
1.1 | 3 | 3 | 256 |
True Class | Score | ||||||||
---|---|---|---|---|---|---|---|---|---|
Load Shape | Large-Cylinder | Large-Square Column | Large-Hexagonal Column | Small-Cylinder | Small-Square Column | Small-Hexagonal Column | TPR | PRE | |
Predicted Class | large-cylinder | 100 | 0 | 0 | 0 | 0 | 0 | 100% | 99% |
large-square column | 0 | 100 | 0 | 0 | 0 | 0 | 100% | 100% | |
large- hexagonal column | 0 | 0 | 100 | 0 | 0 | 0 | 100% | 100% | |
small-cylinder | 1 | 0 | 0 | 99 | 0 | 0 | 99% | 100% | |
small-square column | 0 | 0 | 0 | 0 | 100 | 0 | 100% | 100% | |
small-hexagonal column | 0 | 0 | 0 | 0 | 0 | 100 | 100% | 100% | |
ACC | 99.83% | 99.83% |
True Class | Score | ||||||||
---|---|---|---|---|---|---|---|---|---|
Load Shape | Large-Cylinder | Large-Square Column | Large-Hexagonal Column | Small-Cylinder | Small-Square Column | Small-Hexagonal Column | TPR | PRE | |
Predicted Class | large-cylinder | 177 | 0 | 3 | 0 | 0 | 0 | 98.3% | 98.3% |
large-square column | 0 | 180 | 0 | 0 | 0 | 0 | 100% | 100% | |
large-hexagonal column | 2 | 0 | 175 | 0 | 0 | 3 | 97.2% | 98.3% | |
small-cylinder | 1 | 0 | 0 | 170 | 0 | 10 | 94.4% | 99.4% | |
small-square column | 0 | 0 | 0 | 1 | 176 | 3 | 97.7% | 97.7% | |
small-hexagonal column | 0 | 0 | 0 | 0 | 4 | 176 | 97.7% | 96.7% | |
ACC | 97.55% | 98.4% |
True Class | Score | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
Load Shape | Large-Cylinder | Large-Square Column | Large-Hexagonal Column | Small-Cylinder | Small-Square Column | Small-Hexagonal Column | Other Shape | TPR | PRE | |
Predicted Class | large-cylinder | 50 | 0 | 0 | 0 | 0 | 0 | 0 | 100% | 100% |
large-square column | 0 | 50 | 0 | 0 | 0 | 0 | 0 | 100% | 100% | |
large-hexagonal column | 0 | 0 | 49 | 0 | 0 | 0 | 0 | 98% | 100% | |
small-cylinder | 0 | 0 | 0 | 49 | 0 | 0 | 0 | 98% | 100% | |
small-square column | 0 | 0 | 0 | 0 | 48 | 0 | 0 | 96% | 100% | |
small-hexagonal column | 0 | 0 | 0 | 0 | 0 | 49 | 0 | 98% | 100% | |
other shape | 0 | 0 | 1 | 1 | 2 | 1 | 90 | 100% | 94.7% | |
ACC | 98.5% | 99.2% |
True Class | Score | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
Load Shape | Large-Cylinder | Large-Square Column | Large-Hexagonal Column | Small-Cylinder | Small-Square Column | Small-Hexagonal Column | Thicker Large-Cylinder | TPR | PRE | |
Predicted Class | large-cylinder | 50 | 0 | 0 | 0 | 0 | 1 | 0 | 100% | 98% |
large-square column | 0 | 50 | 0 | 0 | 0 | 0 | 0 | 100% | 100% | |
large-hexagonal column | 0 | 0 | 50 | 0 | 0 | 0 | 0 | 100% | 100% | |
small-cylinder | 0 | 0 | 0 | 50 | 1 | 0 | 0 | 100% | 98% | |
small-square column | 0 | 0 | 0 | 0 | 49 | 0 | 0 | 98% | 100% | |
small-hexagonal column | 0 | 0 | 0 | 0 | 0 | 49 | 0 | 98% | 100% | |
thicker large-cylinder | 0 | 0 | 0 | 0 | 0 | 0 | 50 | 100% | 100% | |
ACC | 99.42% | 99.42% |
Experiment | Sampling Time | STFT | AI Classification | Total |
---|---|---|---|---|
Experiment 1 | 0.100 s | 0.092 s | 0.160 s | 0.352 s |
Experiment 2 | 1.230 s | 1.422 s | ||
Experiment 3 | CNN: 0.590 s AE: 0.036 s | 0.818 s |
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Hung, C.-W.; Zeng, S.-X.; Lee, C.-H.; Li, W.-T. End-to-End Deep Learning by MCU Implementation: An Intelligent Gripper for Shape Identification. Sensors 2021, 21, 891. https://doi.org/10.3390/s21030891
Hung C-W, Zeng S-X, Lee C-H, Li W-T. End-to-End Deep Learning by MCU Implementation: An Intelligent Gripper for Shape Identification. Sensors. 2021; 21(3):891. https://doi.org/10.3390/s21030891
Chicago/Turabian StyleHung, Chung-Wen, Shi-Xuan Zeng, Ching-Hung Lee, and Wei-Ting Li. 2021. "End-to-End Deep Learning by MCU Implementation: An Intelligent Gripper for Shape Identification" Sensors 21, no. 3: 891. https://doi.org/10.3390/s21030891