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- research-articleJune 2023
Electrochemical performance of gold-decorated graphene electrodes integrated with SiC
- Ivan Shtepliuk,
- Jing-Xin Jian,
- Nikolaos Pliatsikas,
- Emanuela Schilirò,
- Tihomir Iakimov,
- Gholamreza Yazdi,
- Ivan G. Ivanov,
- Filippo Giannazzo,
- Kostas Sarakinos,
- Rositsa Yakimova
AbstractHere we investigate the interface properties of gold (Au) decorated graphenized surfaces of 4H-SiC intended for electrochemical electrodes. These are fabricated using a two-step process: discontinuous Au layers with a nominal thickness ...
- research-articleMay 2023
Impact of annealing on structural and optical properties of ZnO thin films
AbstractThis paper analyzes the effect of annealing on morphological, structural and optical properties of Zinc Oxide (ZnO) thin films and their applications in optical sensing. ZnO thin films were deposited using radio frequency (RF) ...
- research-articleOctober 2022
Tempered expectation-maximization algorithm for the estimation of discrete latent variable models
Computational Statistics (CSTAT), Volume 38, Issue 3Pages 1391–1424https://doi.org/10.1007/s00180-022-01276-7AbstractMaximum likelihood estimation of discrete latent variable (DLV) models is usually performed by the expectation-maximization (EM) algorithm. A well-known drawback is related to the multimodality of the log-likelihood function so that the estimation ...
- research-articleMarch 2022
An optimized NiP seed layer coating method for through glass via (TGV)
- Yuzhe Chen,
- Jihua Zhang,
- Libin Gao,
- Siyue Zou,
- Kexin Liang,
- Zhongzhe Liu,
- Zhen Fang,
- Hongwei Chen,
- Qinyan Ye
AbstractThrough Glass vias (TGV) metallization can realize the interconnection of components between the circuit boards. Metallic seed layer is required in order to realize copper filling through via. Vias are created by hydrofluoric acid ...
Graphical abstractDisplay Omitted
Highlights- The TGV metallization is realized by the Ni activation process and Ni-P electroless plating.
- research-articleFebruary 2022
Optical and electrical properties of ZnO/Mo/ZnO multilayer films processed at different annealing temperatures
Microsystem Technologies (MITE), Volume 28, Issue 2Pages 615–620https://doi.org/10.1007/s00542-019-04453-9AbstractZnO/Mo/ZnO transparent conductive thin films are deposited on Corning glass substrates using an RF magnetron sputtering system. The optical and electrical properties of the thin films are then examined following annealing for 40 min at ...
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- ArticleSeptember 2021
Capsule Networks with Routing Annealing
Artificial Neural Networks and Machine Learning – ICANN 2021Pages 529–540https://doi.org/10.1007/978-3-030-86362-3_43AbstractCapsule Networks overcome some shortcomings of convolutional neural networks organizing neurons into groups of capsules. Capsule layers are dynamically connected by means of an iterative routing mechanism, which models the connection strengths ...
- research-articleFebruary 2021
Minor-embedding heuristics for large-scale annealing processors with sparse hardware graphs of up to 102,400 nodes
- Yuya Sugie,
- Yuki Yoshida,
- Normann Mertig,
- Takashi Takemoto,
- Hiroshi Teramoto,
- Atsuyoshi Nakamura,
- Ichigaku Takigawa,
- Shin-ichi Minato,
- Masanao Yamaoka,
- Tamiki Komatsuzaki
Soft Computing - A Fusion of Foundations, Methodologies and Applications (SOFC), Volume 25, Issue 3Pages 1731–1749https://doi.org/10.1007/s00500-020-05502-6AbstractMinor-embedding heuristics have become an indispensable tool for compiling problems in quadratically unconstrained binary optimization (QUBO) into the hardware graphs of quantum and CMOS annealing processors. While recent embedding heuristics have ...
- articleJuly 2019
An Assembly Line Balancing Application on Oven Production Line with Hyper-Heuristics
International Journal of Operations Research and Information Systems (IJORIS), Volume 10, Issue 3Pages 44–58https://doi.org/10.4018/IJORIS.2019070104In this study, an oven assembly line that is planning to re-establish manufacturing to increase the efficiency of the assembly process. The importance of the problem emerges from a real-world application consisting of product-oriented restrictions. ...
- research-articleJune 2019
Production of polycrystalline Bi2Te3 nanostructures and the effect of annealing on their electrical conductivity
Microelectronic Engineering (MCEE), Volume 214, Issue CPages 44–49https://doi.org/10.1016/j.mee.2019.04.023AbstractP- and n-doped bismuth telluride (Bi2Te3) polycrystalline nanostructures were prepared on structured PECVD-oxide-layers using magnetron sputtering and a lithography independent deposition and back-etching step. The resulting ...
Graphical abstractDisplay Omitted
Highlights- Lithography idependent deposition and back-etching process for Bi2Te3 structures
- ArticleDecember 2018
Graph Minors from Simulated Annealing for Annealing Machines with Sparse Connectivity
- Yuya Sugie,
- Yuki Yoshida,
- Normann Mertig,
- Takashi Takemoto,
- Hiroshi Teramoto,
- Atsuyoshi Nakamura,
- Ichigaku Takigawa,
- Shin-Ichi Minato,
- Masanao Yamaoka,
- Tamiki Komatsuzaki
AbstractThe emergence of new annealing hardware in the last decade and its potential for efficiently solving NP hard problems in quadratically unconstrained binary optimization (QUBO) by emulating the ground state search of an Ising model are likely to ...
- research-articleNovember 2017
Large-scale vehicle routing problems
Computers and Operations Research (CORS), Volume 87, Issue CPages 52–62https://doi.org/10.1016/j.cor.2017.05.014A simplified approach to tuning a Quantum Annealing algorithm for vehicle scheduling problems.A systematic approach to tuning a Quantum Annealing algorithm for vehicle scheduling problems.Improvements over best-known results for many very-large scale ...
- research-articleApril 2016
Characterization for the photomask fabrication based on a high-resolution technique with a non-chemically amplified resist and a post-exposure bake
Microelectronic Engineering (MCEE), Volume 155, Issue CPages 7–13https://doi.org/10.1016/j.mee.2016.01.037A high-resolution technique has been developed for the fabrication of photomasks for 10nm logic nodes and beyond. Current mask manufacturing techniques use a chemically amplified resist (CAR) material that has a complex mechanism of acid generation; ...
- research-articleDecember 2015
The optical and electrical properties of gallium-doped ZnO thin film with post-annealing processes of various atmospheres
Microelectronic Engineering (MCEE), Volume 148, Issue CPages 59–63https://doi.org/10.1016/j.mee.2015.08.002In this study, the GZO thin film were deposited with different RF powers and plasma gas of pure argon, 5% oxygen to argon ratio, and 10% oxygen argon ratio. After that, post-thermal annealing processes were performed at the temperature of 300 C to 500 C ...
- research-articleNovember 2015
High temperature thermal stability studies of ultrathin Al2O3 layers deposited on native oxide and sulphur passivated InGaAs surfaces
Microelectronic Engineering (MCEE), Volume 147, Issue CPages 249–253https://doi.org/10.1016/j.mee.2015.04.114Display Omitted Enhanced thermal stability of the sulphur passivated Al2O3/InGaAs interface.Substantial reduction of the interfacial oxide at high temperature.Preserving InGaAs stoichiometry on sulphur treated surface at high temperature.A 700 C anneal ...
- research-articleNovember 2015
Effect of forming gas annealing on the inversion response and minority carrier generation lifetime of n and p-In0.53Ga0.47As MOS capacitors
Microelectronic Engineering (MCEE), Volume 147, Issue CPages 325–329https://doi.org/10.1016/j.mee.2015.04.103Display Omitted Inversion response observed for n-type &p-type Au/Ni/Al2O3/In0.53Ga0.47As MOS devices.Cox extraction method from relationship between inversion capacitance and conductance.In0.53Ga0.47As minority carrier generation lifetime modified by ...
- research-articleAugust 2015
Fabrication of a high-resolution mask by using variable-shaped electron beam lithography with a non-chemically amplified resist and a post-exposure bake
Microelectronic Engineering (MCEE), Volume 143, Issue CPages 48–54https://doi.org/10.1016/j.mee.2015.03.026Display Omitted Photomasks have been fabricated by VSB 50keV EBL.Examine PEB temperature dependence of CD error.Resist sensitivity by changing PEB temperature has been verified.Demonstrate the use of PEB with non-CAR resist helps suppress proximity ...
- research-articleAugust 2015
Iterative particle filter for visual tracking
Image Communication (IMAG), Volume 36, Issue CPages 140–153https://doi.org/10.1016/j.image.2015.07.001Particle filter (PF) has been the subject of considerable attention in visual tracking. How to approach the true target state with computation cost as low as possible has always been an important issue. In this paper, a novel iterative PF (IPF) is ...
- ArticleJuly 2015
Evolving Close-to-Real Digital Microstructures in Polycrystalline Materials
SIMULTECH 2015: Proceedings of the 5th International Conference on Simulation and Modeling Methodologies, Technologies and ApplicationsPages 100–106https://doi.org/10.5220/0005531401180124For more than three decades now simulation of recrystallization and grain growth phenomena in annealed metals have been studied through a variety of computer modeling techniques including that of Monte Carlo (MC) simulation. In this study, we have been ...
- research-articleApril 2015
Comparison of electrical and physical characteristics between Gd2O3 and Ti-doped GdTixOy trapping layers
- Chuan Haur Kao,
- Hsiang Chen,
- Chun Chi Chen,
- Ching Pang Chen,
- Jung Ji Wang,
- Chian You Chen,
- Yun Ti Chen,
- Jun Han Lin,
- Yu Cheng Chu
Microelectronic Engineering (MCEE), Volume 138, Issue CPages 21–26https://doi.org/10.1016/j.mee.2015.01.012Display Omitted Gd2O3-based flash memories have been fabricated.Ti doping and annealing could enhance good memory performance.Multiple material analyses confirm that annealing eliminated defects.Electrical measurements were used to evaluate memory ...
- research-articleApril 2015
Material and electrical characterizations of high-k Ta2O5 dielectric material deposited on polycrystalline silicon and single crystalline substrate
Microelectronic Engineering (MCEE), Volume 138, Issue CPages 36–41https://doi.org/10.1016/j.mee.2015.01.011Display Omitted RTA annealing can mitigate bulk defects in Ta2O5 by repairing oxygen vacancies.Multiple electrical and material analyses on two types of substrates.The interface on top of a single crystalline substrate had fewer structural defects.The ...