Nothing Special   »   [go: up one dir, main page]

skip to main content
10.1145/2839462acmotherconferencesBook PagePublication PagesteiConference Proceedingsconference-collections
TEI '16: Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction
ACM2016 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction Eindhoven Netherlands February 14 - 17, 2016
ISBN:
978-1-4503-3582-9
Published:
14 February 2016
In-Cooperation:
Next Conference
Reflects downloads up to 22 Nov 2024Bibliometrics
Contributors
  • Philips Research
  • Eindhoven University of Technology
  • Clemson University
  • KU Leuven
  • Eindhoven University of Technology
  • University of Twente
  • Eindhoven University of Technology

Index Terms

  1. Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction
    Index terms have been assigned to the content through auto-classification.
    Please enable JavaScript to view thecomments powered by Disqus.

    Recommendations

    Acceptance Rates

    TEI '16 Paper Acceptance Rate 45 of 178 submissions, 25%;
    Overall Acceptance Rate 393 of 1,367 submissions, 29%
    YearSubmittedAcceptedRate
    TEI '211364029%
    TEI '201323728%
    TEI '191103633%
    TEI '181303728%
    TEI '171514127%
    TEI '161784525%
    TEI '152226328%
    TEI '141724627%
    TEI '131364835%
    Overall1,36739329%