MICRO

Powerful forces of innovation and demands from computing infrastructure are pushing the boundaries of traditional processing platforms in an unprecedented manner. Artificial Intelligence, Cybersecurity, Big Data, autonomous vehicles, 5G or NextG communication technologies, and Internet of Things (IoT) are some of the application areas where field of multi/many-core processing platforms are being used. This propels research towards novel architectures consisting of heterogeneous, accelerator-rich scenarios with highly specialized chiplets handling specialized task threads. Such massive integration both inside and across a single die imposes ever-increasing demand on the interconnection sub-system. Networks-on-Chips have been the de facto mechanism of connecting a scalable number of cores within the same die. However, the increasing power-performance demands as well the security requirements of the application domains require a constant churn of the interconnection architectures. The use of emerging technologies such as interposers, wireless and optical interconnects help alleviate some of these challenges while exposing other novel opportunities. This evolving landscape makes the interconnection architecture a critical determinant of power-performance bottlenecks as well as reliability and security of the overall system they are deployed in.

In this context, NoCArc continues its evolution and seeks to be a focused forum for researchers and practitioners to present and discuss innovative ideas and solutions related to the design, implementation, and application of interconnect fabrics within complex multi/many-core systems with conventional or emerging technologies such as 3D, optical, or wireless communications at the chip or system scale.