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Interconnect-power dissipation in a microprocessor

Published: 14 February 2004 Publication History

Abstract

Interconnect power is dynamic power dissipation due to switching of interconnection capacitances. This paper describes the characterization of interconnect power in a state-of-the-art high-performance microprocessor designed for power efficiency. The analysis showed that interconnect power is over 50% of the dynamic power. Over 90% of the interconnect power is consumed by only 10% of the interconnections. Relations of interconnect power to wire length distribution and hierarchy level of nets were examined. In light of the results, a router's algorithms were modified, to use larger wire spacing and minimal length routing for the high power consuming interconnects. The power-aware router algorithm was tested on synthesized blocks, demonstrating average saving of 14% in the dynamic power consumption without timing degradation or area increase. The results demonstrate the obtainable benefits of tuning physical design algorithms to save power.

References

[1]
Borkar, S. Y. Design Challenges of Technology Scaling, IEEE MICRO, Jul./Aug. 1999, Vol. 19, No. 4, 23--29.
[2]
Chatterjee, A., Nandakumar, M., and Chen, I.C. An Investigation of the Impact of Technology Scaling on Power Wasted as Short-Circuit Current in Low Voltage Static CMOS Circuits. in International Symposium on Low Power Electronic Design, 1996, 145--150.
[3]
Meindl, J. D., Davis, J. A., Zarkesh-Ha, P., Patel, C. S., Martin, K. P., and Kohl, P. A. Interconnect Opportunities for Gigascale Integration. IBM J. Res. & Dev., vol. 46, Mar/May 2002, 245--263.
[4]
Rabaey, J., Chandrakasan, A., and Nikolic, B. Digital Integrated Circuits: Second Edition. Prentice Hall, 2002.
[5]
Liu, D., Svensson, C. Trading Speed for Low Power by Choice of Supply and Threshold Voltages. IEEE Journal of Solid-State Circuits, Vol. 28, No. 1, Jan. 1993.
[6]
Pering, T., Burd, T., and Brodersen, R. The Simulation and Evaluation of Dynamic Voltage Scaling Algorithms. in Proceedings of the 1998 International Symposium on Low Power Electronics and Design, Aug. 1998, 76--81.
[7]
Berkelaar, M.R.C.M., and Jess, J.A.G. Gate Sizing in MOS Digital Circuits with Linear Programming. in Proceedings of the European Design Automation Conference, Mar. 1990, 12--15.
[8]
Farrahi, A.H., Chen, C., Srivastava, A., Tellez, G., and Sarrafzadeh, M. Activity-Driven Clock Design. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 20, No. 6, Jun. 2001.
[9]
Genossar, D., and Shamir, N., Intel® Pentium® M Processor Power Estimation, Budgeting, Optimization, and Validation. Intel Technology Journal, Vol. 07, Iss. 02, May 2003, 43--50.
[10]
Arunachalam, R., Rajagopal, K., and Pileggi, L.T. TACO: Timing Analysis with Coupling. in Proceedings of the Design Automation Conference, Jun. 2000, 266--269.
[11]
Stroobandt, D., Van Campenhout, J. Accurate Interconnection Length Estimations for Predictions Early in the Design Cycle. VLSI Design, Vol. 10 (1), 1999, 1--20.
[12]
Davis, J., De, V.K., and Meindl, J. A Stochastic Wire-Length Distribution for Gigascale Integration (GSI) -- Part I: Derivation and Validation. IEEE Transaction on Electron Devices, Vol. 45, No. 3, Mar. 1998, 580--589.
[13]
Dally, W. J., and Lacy, S., VLSI Architecture: Past, Present, and Future. in Proceedings of the Advanced Research in VLSI conference, Atlanta, GA, 1999.
[14]
Horowitz, M., Ho, R., and Mai, K. The future of wires. in Proceedings of the IEEE, Vol. 89, no. 4, Apr. 2001.
[15]
Ronen, R., Mendelson, A., Lai, K., Lu, S-L., Pollack, F., Shen, J.P. Coming Challenges in Microarchitecture and Architecture. Proceedings of the IEEE, Vol. 89, No. 3, Mar. 2001.
[16]
International Technology Roadmap for Semiconductors (2001 Edition). Available: http://public.itrs.net/Files/2001ITRS/Home.htm
[17]
Chern, J.H., Huang, J., Arledge, L., Li, P.C., and Yang, P. Multilevel Metal Capacitance Models for CAD Design Synthesis Systems. IEEE Electron Device Letters, vol. 13, Jan. 1992, 32--34.
[18]
Cong, J., He, L., Koh C.K., and Madden, P. Performance Optimization of VLSI Interconnect Layout. Integration, the VLSI Journal, Vol. 21, Nov. 1996, 1--94.
[19]
Lee, Y.-M., Lai, H.Y., Chen, C.C.-P. Optimal Spacing and Capacitance Padding for General Clock Structures. in Proceedings of the conference on Asia South Pacific Design Automation Conference, Jan. 2001, 115--119.
[20]
Dees, W.A., and Smith, R.J. Performance of Interconnection Rip-Up and Reroute Strategies. in Proceedings of the 18th Design Automation Conference, Jun. 1981, 382--390.

Cited By

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  • (2024)Low Power Network-on-Chip Architecture Design Technique2024 IFIP/IEEE 32nd International Conference on Very Large Scale Integration (VLSI-SoC)10.1109/VLSI-SoC62099.2024.10767805(1-6)Online publication date: 6-Oct-2024
  • (2024)Low-Power Bus Encoding by Ternary LWC and Quaternary Transition Signaling: From Initial Concept to Circuit DesignIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.333727732:4(682-694)Online publication date: Apr-2024
  • (2024)CAUTS: Clock Tree Optimization via Skewed Cells With Complementary Asymmetrical Uniform Transistor SizingIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.332859232:1(137-149)Online publication date: Jan-2024
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Reviews

Parthasarathi Dasgupta

This paper discusses the important issue of power dissipation in the design of high-performance microprocessors. Its major focus is on dynamic power consumption due to the switching of capacitors, and on the role of the interconnect power in this. The authors performed interconnect power analysis on a state-of-the-art microprocessor, made up of 77 million transistors in 130nm technology. The analysis was based on a stochastic dynamic power estimation method. For the purpose of the analysis, the authors considered the signal interconnect lengths between the drivers and receivers, but did not include the global clock grid. However, the capacitances included all types of capacitive loads, including the diffusion capacitances of the drivers, capacitances of the metal wiring, and the gate load of the receivers. Repeater gate and diffusion capacitances were also added to the original net. Metal capacitances included cross-capacitances between the nets, with the unit miller coupling factor (MCF). The results of the analysis indicate that interconnect switching accounts for about half of the total dynamic power consumption. The net topologies were split into two parts, namely, local and global nets. The local net was typically observed to have 30 percent higher fan out, and about 80 percent smaller interconnect capacitance, compared to the global net. However, as observed in the paper, the interconnect power was divided almost equally between the local and the global nets, due to the larger number of local nets. Ninety percent of the dynamic power was consumed by ten percent of the nets, and power reduction for these nets thus appeared to be the most demanding. The authors end by suggesting some methods to implement power-aware routing. One vital suggestion was to reduce capacitances, possibly via interconnect length reduction, and via increased spacing between routing wires. As a possible extension of an existing industrial router, based on rip-up and reroute, some of the nets were classified as power-critical nets, and rip-up of these nets was of the lowest priority. Some potential future work is also discussed. Online Computing Reviews Service

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Published In

cover image ACM Conferences
SLIP '04: Proceedings of the 2004 international workshop on System level interconnect prediction
February 2004
111 pages
ISBN:1581138180
DOI:10.1145/966747
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 14 February 2004

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Author Tags

  1. interconnect power
  2. low-power design
  3. routing
  4. wire spacing

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Overall Acceptance Rate 6 of 8 submissions, 75%

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Cited By

View all
  • (2024)Low Power Network-on-Chip Architecture Design Technique2024 IFIP/IEEE 32nd International Conference on Very Large Scale Integration (VLSI-SoC)10.1109/VLSI-SoC62099.2024.10767805(1-6)Online publication date: 6-Oct-2024
  • (2024)Low-Power Bus Encoding by Ternary LWC and Quaternary Transition Signaling: From Initial Concept to Circuit DesignIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.333727732:4(682-694)Online publication date: Apr-2024
  • (2024)CAUTS: Clock Tree Optimization via Skewed Cells With Complementary Asymmetrical Uniform Transistor SizingIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.332859232:1(137-149)Online publication date: Jan-2024
  • (2024)Efficient Ternary Logic Circuits Optimized by Ternary Arithmetic AlgorithmsIEEE Transactions on Emerging Topics in Computing10.1109/TETC.2023.332105012:3(826-839)Online publication date: Jul-2024
  • (2024)Reducing Crosstalk in Monolithic-3-D Structures Using a Graphene Shielding LayerIEEE Transactions on Electron Devices10.1109/TED.2024.348224971:12(7928-7934)Online publication date: Dec-2024
  • (2024)Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, and Quantum Computing Systems—Overview, Challenges, and OpportunitiesIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2024.344582914:3(354-370)Online publication date: Sep-2024
  • (2024)PACE: MLP-Based Fast and Accurate Per-Cycle Chip Power Modelling2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)10.1109/ISVLSI61997.2024.00132(689-693)Online publication date: 1-Jul-2024
  • (2024)Oxide Semiconductor Heterojunction Transistor with Negative Differential Transconductance for Multivalued Logic CircuitsACS Nano10.1021/acsnano.3c0916818:2(1543-1554)Online publication date: 4-Jan-2024
  • (2024)Optics‐Enabled Highly Scalable Inverter for Multi‐Valued LogicLaser & Photonics Reviews10.1002/lpor.20230104618:12Online publication date: 3-Aug-2024
  • (2023)Power Consumption in CMOS CircuitsElectromagnetic Field in Advancing Science and Technology10.5772/intechopen.105717Online publication date: 29-Mar-2023
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