Abstract
Electron beam probing is applied for test and analysis of miniaturisedMCM structures. Wiring structures are tested for shorts and opens while fullyassembled MCMs are analysed in order to identify process or design problems[1, 2]. An electron beam short/open tester for laminated substrates has beendeveloped and installed. It allows the test of substrates up to a size of300 × 300 mm2 with a spot size ofbelow 30 μm without mechanical movement. The system is automated for routineapplication in the fabrication line. Electron beam probe stations are common tools for design verification and debugging ofintegrated circuits. This type of system was adapted to MCMrequirements. The travel range was extended to 80 × 100 mm2 to allow for waveform measurements anddiagnostics.
Similar content being viewed by others
References
M. Brunner, R. Schmid, R. Schmitt, M. Sturm, and O. Gessner, “Electron-Beam MCM Testing and Probing, IEEE Trans. on Components, Packaging and Manufacturing Technology Part B,” Advanced Packaging, Vol. 17, No.1, 1994.
M. Brunner, R. Schmid, R. Schmitt, and O. Gessner, “Contactless Testing of Multi-Chip Modules,” Microelectronic Engineering, Vol. 24, 1994.
J. Frosien, P. Fazekas, S. Lanio, G. Schönecker, N. Webster, and Y. Tokunaga,“Breakthrough in Internal Failure Analysis of Integrated Circuits,” Microelectronic Engineering, Vol. 16, pp. 79–86, 1992.
M. Brunner and R. Schmid, “Electron-Beam MCM Substrate Tester,” IEEE Multi-Chip Module Conference MCMC-93, 1993, pp. 62–68.
H. Rehme, Elektronenstrahl-Potentialmeßtechnik, in M. Zerbst (ed.), Springer, Meß-und Prüftechnik, 1986.
B. Lischke, D. Winkler, and R. Schmitt,“The Limits of High-Speed E-Beam Testing,” Microelectronic Engineering, Vol. 7, pp. 21–39, 1987.
B. Kazan and M. Knoll, Electronic Image Storage, Academic Press, Vol. 22, 1968.
H.C. Pfeiffer, S.D. Golladay, and F.J. Hohn, “A Practical E-Beam System for High Speed Continuity Testing of Conductor Networks,” Proc. XIth Int. Cong. On Electron Microscopy, 1986, pp. 185–188.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Schmid, R., Schmitt, R., Brunner, M. et al. Electron Beam Probing—A Solution for MCM Test and Failure Analysis. Journal of Electronic Testing 10, 55–63 (1997). https://doi.org/10.1023/A:1008270430950
Issue Date:
DOI: https://doi.org/10.1023/A:1008270430950