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Material Properties of a Low Contraction and Resistivity Silicon–Aluminum Composite for Cryogenic Detectors

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Abstract

We report on the cryogenic properties of a low-contraction silicon–aluminum composite, namely Japan Fine Ceramics SA001, to use as a packaging structure for cryogenic silicon devices. SA001 is silicon–aluminum composite material (75% silicon by volume) and has a low thermal expansion coefficient (\(\sim \)1/3 that of aluminum). The superconducting transition temperature of SA001 is measured to be 1.18 K, which is in agreement with that of pure aluminum and is thus available as a superconducting magnetic shield material. The residual resistivity of SA001 is 0.065 µΩm, which is considerably lower than equivalent silicon–aluminum composite material. The measured thermal contraction of SA001 immersed in liquid nitrogen is \(\frac{L_{293\,\mathrm {K}}-L_{77\,\mathrm {K}}}{L_{293\,\mathrm {K}}}=0.12\%\), which is consistent with the expected rate obtained from the volume-weighted mean of the contractions of silicon and aluminum. The machinability of SA001 is also confirmed with a demonstrated fabrication of a conical feedhorn array, with a wall thickness of 100 µm. These properties are suitable for packaging applications for large-format superconducting detector devices.

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Notes

  1. https://www.japan-fc.co.jp/en/products/cate01/cate0104/sisic75vol-sa001.html.

  2. \({T_c}\) of SA001 is defined at the temperature of half of the normal resistivity, which is consistent with the definition of \({T_c}\) of CE7 [6].

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Acknowledgements

Measurement samples of SA001 were provided by Japan Fine Ceramics Co., Ltd. This study was carried out under the Joint Research Program of the Institute of Low-Temperature Science, Hokkaido University (21G006, 21G024, 20G013, and 20G033). This study was carried out in cooperation with the Advanced Technology Center of the National Astronomical Observatory of Japan (NAOJ). This work was supported by NAOJ Research Coordination Committee, NINS, Grant Number 2101-0101, and JSPS KAKENHI Grant Number JP17H02872 and JP19K14754. T.T. is supported by MEXT Leading Initiative for Excellent Young Researchers Grant Number JPMXS0320200188. S.U. is financially supported by JSPS Research Fellowship for Young Scientists and accompanying Grants-in-Aid for JSPS Fellows (No.21J20742). The datasets generated and analyzed during the current study are available from the corresponding author on reasonable request.

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Authors and Affiliations

  1. Kitami Institute of Technology, 165 Koen-cho, Kitami, Hokkaido, 090-8507, Japan

    Tatsuya Takekoshi

  2. Institute of Astronomy, Graduate School of Science, The University of Tokyo, 2-21-1 Osawa, Mitaka, Tokyo, 181-0015, Japan

    Tatsuya Takekoshi, Kianhong Lee, Kah Wuy Chin, Shinsuke Uno & Shuhei Inoue

  3. Graduate School of Informatics and Engineering, The University of Electro-Communications, Cho-fu, Tokyo, 182-8585, Japan

    Toyo Naganuma

  4. Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo, 152-8551, Japan

    Yuka Niwa

  5. Institute of Low Temperature Science, Hokkaido University, Sapporo, 060-0819, Japan

    Kazuyuki Fujita & Akira Kouchi

  6. Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency, Sagamihara, 252-5210, Japan

    Shunichi Nakatsubo

  7. National Institute of Information and Communications Technology, Kobe, Hyogo, 651-2492, Japan

    Satoru Mima

  8. The Institute of Physical and Chemical Research (RIKEN), 2-1 Hirosawa, Wako-Shi, Saitama, 351-0198, Japan

    Satoru Mima

  9. National Astronomical Observatory of Japan, Mitaka, Tokyo, 181-8588, Japan

    Tai Oshima

  10. The Graduate University for Advanced Studies (SOKENDAI), 2-21-1 Osawa, Mitaka, Tokyo, 181-0015, Japan

    Tai Oshima

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  1. Tatsuya Takekoshi
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Correspondence to Tatsuya Takekoshi.

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Takekoshi, T., Lee, K., Chin, K.W. et al. Material Properties of a Low Contraction and Resistivity Silicon–Aluminum Composite for Cryogenic Detectors. J Low Temp Phys 209, 1143–1150 (2022). https://doi.org/10.1007/s10909-022-02795-9

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