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Thermal stress hysteresis and stress relaxation in an epoxy film

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Abstract

Thermal cycling of an epoxy coating on silicon through the glass transition temperature (T g) revealed a large stress hysteresis on the first thermal cycle through T g and a change in the stress–temperature slope at T g resulting from the change in the epoxy elastic properties due to the glass transition. This stress hysteresis was not observed on subsequent thermal cycles through T g. However, after the coating was annealed (aged) below T g (for hours or longer)—during which the stress relaxed exponentially with time—the stress hysteresis returned. The magnitude of stress hysteresis, on cycling through T g, was found to correlate to the magnitude of long-time relaxation that occurred during annealing at temperatures below T g.

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References

  1. Cherepanov GP (1995) J Appl Phys 78:6826

    Article  CAS  Google Scholar 

  2. Kuczynski J, Sinha AK (2001) IBM J Res Dev 45:783

    Article  CAS  Google Scholar 

  3. Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z (2004) Thin Solid Films 462–463:446

    Article  Google Scholar 

  4. Ernst LJ, Zhang GQ, Jansen KMB, Bressers HJL (2003) J Electron Packaging 125:539

    Article  CAS  Google Scholar 

  5. Koguchi H, Sasaki C, Nishida K (2003) J Electron Packaging 125:414

    Article  Google Scholar 

  6. Meuwissen MHH, De Boer HA, Steijvers HLAH, Schreurs PJG, Geers MGD (2004) Microelectron Reliab 44:1985

    Article  CAS  Google Scholar 

  7. Stevens JR, Ivey DG (1958) J Appl Phys 29:1390

    Article  CAS  Google Scholar 

  8. Kim JS, Paik KW, Seo SH (1999) J Appl Phys 86:5474

    Article  CAS  Google Scholar 

  9. Zhao J-H, Kiene M, Hu C, Ho P (2000) Appl Phys Lett 77:2843

    Article  CAS  Google Scholar 

  10. Que L, Gianchandani YB (2000) J Vac Sci Technol B 18:3450

    Article  CAS  Google Scholar 

  11. Perera DY, Schutyser P (1994) Progr Org Coat 24:299

    Article  CAS  Google Scholar 

  12. Perera DY (2002) Progr Org Coat 44:55

    Article  CAS  Google Scholar 

  13. Perera DY (2003) Progr Org Coat 47:61

    Article  CAS  Google Scholar 

  14. Chang W-J, Fang T-H, Lin C-M (2005) J Appl Phys 97:103521

    Article  Google Scholar 

  15. Montserrat S, Gomez Ribelles JL, Meseguer JM (1998) Polymer 39:3801

    Article  CAS  Google Scholar 

  16. Cook WD, Mehrabi M, Edward GH (1999) Polymer 40:1209

    Article  CAS  Google Scholar 

  17. Montserrat S (1994) J Polym Phys B 32:509

    Article  CAS  Google Scholar 

  18. Montserrat S (2000) J Polym Phys B 38:2272

    Article  CAS  Google Scholar 

  19. Timoshenko S (1925) J Opt Soc Am 11:233

    Article  CAS  Google Scholar 

  20. Corcoran EM (1969) J Paint Technol 41:635

    CAS  Google Scholar 

  21. Brantley WA (1973) J Appl Phys 44:534

    Article  CAS  Google Scholar 

  22. Yan G, White JR (1999) Polym Eng Sci 39:1856

    Article  CAS  Google Scholar 

  23. Gaynor JF, Desu SB (1994) J Mat Sci Lett 13:236

    Article  CAS  Google Scholar 

  24. Shen JJ, Shao Z, Li S (1995) Polymer 36:3479

    Article  CAS  Google Scholar 

  25. Voloshin S, Tsao P-H, Pearson RA (1998) J Electron Packaging 120:314

    Article  Google Scholar 

  26. Fesko DG (2000) Polymer Eng Sci 40:1495

    Article  CAS  Google Scholar 

  27. Freund LB, Floro JA, Chason E (1999) Appl Phys Lett 74:1987

    Article  CAS  Google Scholar 

Download references

Acknowledgement

The author (JT) acknowledges Awirut Maglai for assistance with sample preparation and Bob Matz for helpful discussions.

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Authors and Affiliations

  1. Advanced Mechanical Technology, Mechanical Research and Development, Seagate Technology, Bloomington, MN, 55435, USA

    Jeremy Thurn

  2. Materials Science and Modeling, Performance Plastics and Chemicals R&D, The Dow Chemical Company, Freeport, TX, 77541, USA

    Theresa Hermel-Davidock

Authors
  1. Jeremy Thurn
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  2. Theresa Hermel-Davidock
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Corresponding author

Correspondence to Jeremy Thurn.

Appendix A: Non-linear deformation analysis

Appendix A: Non-linear deformation analysis

The use of Eq. 1 requires that the strains and rotations in the system be infinitesimally small. This requirement was examined using the analysis of Freund et al. [27], who showed that non-linear deformation effects can be avoided if the dimensionless parameters S or K are less than 0.3–0.4 or 0.2, respectively:

$$ S = 1.5\varepsilon _{\hbox{m}} R^2 t\frac{{(1 - \nu _{\hbox{s}} )E_{\hbox{f}} }} {{(1 - \nu )E_{\hbox{s}} t_{\hbox{s}}^3 }} $$
(A1)

and

$$ K = 0.25R^2 \frac{{\Delta \kappa }} {{t_{\hbox{s}} }}, $$
(A2)

where ε m is the imposed thermal mismatch strain, R is the sample radius (50 mm), E f is the film Young’s Modulus, and ν is the film Poisson’s Ratio. Since the film mechanical properties are not known, the parameter K was evaluated using the largest change in curvature observed over the course of the experiment, Δκ = 0.02 m−1, to be K = 0.016. As K < 0.2, non-linear deformations were not considered.

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Thurn, J., Hermel-Davidock, T. Thermal stress hysteresis and stress relaxation in an epoxy film. J Mater Sci 42, 5686–5691 (2007). https://doi.org/10.1007/s10853-006-0654-y

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  • DOI: https://doi.org/10.1007/s10853-006-0654-y

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