Abstract
The harsh operating environment of automotive and aerospace applications causes printed circuit board (PCB) connectors to be susceptible to intermittent high contact resistance, which eventually leads to a failure resulting in the loss of signal integrity. Pin fretting within the mating connector is often the cause of these failures. Over the past several years, there has been a significant increase in the laboratory-based testing of sample connectors for pin fretting. These laboratory-based results have shown the primary cause of pin fretting to be due to the relative motion within the mating connector. However, quantification of the relative motion in different vibration environments by considering the dynamics of PCBs has not been studied yet. This paper develops a new methodology for studying pin fretting within the mating connector. The developed methodology is based on the quantification of relative motion as a measure of pin fretting by considering the dynamics of PCBs, printed circuit board assemblies (PCBAs), and mounting brackets. To do this, a continuous, lightly damped, multi-degree of freedom (MDOF) model is developed for the assembly consisting of PCBs, PCBAs, and mounting brackets. The behavior of the system is investigated by exciting the system using harmonic and random vibration signals. In the harmonic signal analysis, a frequency domain-based approach is presented to compute the relative motion of the mating connector, while a pseudo-random time series signal derived from the power spectrum density (PSD) of the signal is used to excite the system for the random vibration excitation analysis. The relative response vector is then computed based on the system’s response. The results of the relative motion of the mating connectors are presented in terms of the maximum amplitude of relative motion and the cumulative relative movement. The significance of the cumulative relative movement is that the complex phenomenon of pin fretting in the mating connectors can be represented by a simple time series model that can be used to correlate the material degradation. Finally, two numerical examples using the analytical and finite element-based (FE) technique are shown to demonstrate the proposed methodology. The examples show that the method proposed here is systematic and constructive in quantifying the pin fretting behavior.
Similar content being viewed by others
Data Availability
All the data, codes, and simulation files will be provided upon request.
References
Cackovic DL, Bollock RL (1994) Proposed alternative test procedure for AAR specification M-965–91 with the vibration test unit. Proceedings of IEEE/ASME Joint Railroad Conference. IEEE
Chen C (2009) A study of the prediction of vibration-induced fretting corrosion in electrical contacts. Auburn University
Coria I, Martín I, Bouzid A-H, Heras I, Abasolo M (2018) Efficient assembly of bolted joints under external loads using numerical FEM. Int J Mech Sci 142:575–582
Flowers GT, Xie F, Bozack MJ, Malucci RD (2004) Vibration thresholds for fretting corrosion in electrical connectors. IEEE Trans Compon Packag Technol 27(1):65–71
Flowers GT, Xie F, Bozack M, Horvath R, Rickett BI, Malucci RD (2005) The influence of contact interface characteristics on vibration-induced fretting degradation. Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts. pp 82-88
Horn J, Kourimsky F, Baderschneider K, Lutsch H (1995) Avoiding fretting corrosion by design. AMP J Technol 4:4–7
Hsu S-W, Liao K-C (2012) Wear analysis and verification of metallic terminals for electronic connectors. Eng Fail Anal 25:71–80
Huang B, Li X, Zeng Z, Chen N (2016) Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector. Microelectron Reliab 66:106–112
Jang J, Park J-W (2020) Simplified vibration PSD synthesis method for MIL-STD-810. Appl Sci 10(2):458
Kalyani UH, Wylie M (2020) Modal finite element analysis of PCBs and the role of material anisotropy. Vib Proced 32:75–80
Liao K-C, Chang C-C (2009) Applications of damage models to durability investigations for electronic connectors. Mater Des 30(1):194–199
Luo Y, Zhang Z, Wu X, Su J (2020) Identification and Sensing of Wear Debris Caused by Fretting Wear of Electrical Connectors. IEICE Trans Electron E103.C(5):246–253
Singh P, Viswanadham P (1997) Failure modes and mechanisms in electronic packages. Springer Science & Business Media
Steinberg DS (2000) Vibration analysis for electronic equipment, Third Edition, John Wiley & Sons
Swingler J, McBride JW (2002) Fretting corrosion and the reliability of multicontact connector terminals. IEEE Trans Compon Packag Technol 25(4):670–676
Vandevoordt KP, Feng M (2009) Dynamic Behavior of Electronic Module Spring Clips, Retention Bar, and Backplane Connector: Modeling and Testing. ASME Int Mech Eng Congress Expo 43789:217–223
Wu B-H, Lee C-Y, Chiang Y-C, Cao S, Cao X, Zhang G, Zhou S, Wang B (2018) Study on the contact performance of electronic EON connectors under axial vibration. IEEE Trans Compon Packag Manuf Technol 8(12):2090–2097
Xie F (2007) A study of vibration-induced fretting corrosion for electrical connectors. Auburn University (Diss)
Xing Y, Xu W (2017) Signal Analysis of Fretting Damages on Electrical Connector Systems, Master's Thesis, Blekinge Institute of Technology, Karlskrona
Yang H, Tong Y, Flowers G, Cheng Z (2016) Capacitance build-up in electrical connectors due to vibration induce fretting corrosion. In: Proc. IEEE 62nd Holm Conference on Electrical Contacts (Holm), pp 152-158
Yang J, Tan CP, He Z, Ching ZY, Tan CC (2017) An effective system-level vibration prediction analysis approach for data storage system chassis. Microsyst Technol 23(9):3097–3105
Yu W, Zeng Z, Peng B, Yan S, Hua Y, Jiang H, Li X, Fan T (2018) Multi-Objective Optimum Design of High-Speed Backplane Connector Using Particle Swarm Optimization. IEEE Access 6:35182–35193. https://doi.org/10.1109/ACCESS.2018.2847732
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflicts of Interest
All authors declare that they have no conflicts of interest.
Additional information
Responsible Editor: V. D. Agrawal
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Doranga, S., Zhou, J. & Poudel, R. Influence of Printed Circuit Board Dynamics on the Fretting Wear of Electronic Connectors: A Dynamic Analysis Approach. J Electron Test 38, 493–510 (2022). https://doi.org/10.1007/s10836-022-06022-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10836-022-06022-x