Abstract
Much effort has been being done to realize the concept of Building Information Modeling (BIM) in building industry. In the civil infrastructure domain, however, BIM has not been prevailing so much yet. To promote BIM in this domain, advantages by adoption of the new methodology, especially the cooperative aspect, must be clearly illustrated. In this paper, cooperative information sharing methodology between a 3D model and structural analysis software for railway viaducts is described.
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Yabuki, N., Lebegue, E., Gual, J., Shitani, T., Li, Z.: International Collaboration for Developing the Bridge Product Model “IFC-BRIDGE”. In: Proc. of the Joint International Conference on Computing and Decision Making in Civil and Building Engineering, Montreal, Canada, pp. 1927–1936 (June 2006)
Yabuki, N.: Representation of caves in a shield tunnel product model. In: Proc. of the 7th European Conference on Product and Process Modelling, Sophia Antipolis, France, pp. 545–550. CRC Press (September 2008)
Yabuki, N.: Toward Adoption of Virtual Construction in the Infrastructure Domain. Journal of Society for Social Management Systems, SMS10-160 (2010)
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© 2012 Springer-Verlag Berlin Heidelberg
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Fujisawa, Y., Yabuki, N. (2012). Cooperative Information Sharing between a 3D Model and Structural Analysis Software for Railway Viaducts. In: Luo, Y. (eds) Cooperative Design, Visualization, and Engineering. CDVE 2012. Lecture Notes in Computer Science, vol 7467. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-32609-7_28
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DOI: https://doi.org/10.1007/978-3-642-32609-7_28
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-32608-0
Online ISBN: 978-3-642-32609-7
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