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Embedded Fingerprint Identification System Based on DSP Chip

  • Conference paper
Advances in Computer Science, Intelligent System and Environment

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 104))

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Abstract

Fingerprint identification system set pattern recognition, image processing, and database technology in one, suitable for a variety of authentication applications, with a wide range of applications. This article describes the method of DSP microprocessor for the silicon materials manufacturing-based embedded fingerprint recognition system method and specifies the system’s hardware and software design process. The system is able to automatically carry out classification, moreover, compare the results with the fingerprint database in real time. Experimental results show that the system can quickly obtain information on the identity of persons to be identified.

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References

  1. Xu, H.-l., Shi, H.-r.: Investigation on S3C2440-based Embedded Fingerprint Identification System. Instrumentation Technology (02), 46–48 (2011)

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  2. Wang, J.: Design of Fingerprint Identification System Based on DSP. Industrial Control Computer (03), 65–67 (2010)

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  3. Pan, J.-j., Zhang, H.-y.: Design of embedded automatic fingerprint identification system. Journal of Beijing Information Science & Technology University (01), 62–65 (2010)

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  4. Ren, L., Chen, L.: Design and Implementation of Fingerprint Verification System Based on Embedded Application. Science Mosaic (03), 82–84 (2010)

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© 2011 Springer-Verlag Berlin Heidelberg

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Wang, F., Gao, G. (2011). Embedded Fingerprint Identification System Based on DSP Chip. In: Jin, D., Lin, S. (eds) Advances in Computer Science, Intelligent System and Environment. Advances in Intelligent and Soft Computing, vol 104. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23777-5_96

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  • DOI: https://doi.org/10.1007/978-3-642-23777-5_96

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-23776-8

  • Online ISBN: 978-3-642-23777-5

  • eBook Packages: EngineeringEngineering (R0)

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