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"A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal ..."

Srinivasan Gopal et al. (2020)

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DOI: 10.1109/TCSI.2020.3013092

access: closed

type: Journal Article

metadata version: 2024-12-12

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  - https://dblp.org/rec/journals/tcas/GopalDPH20
Srinivasan Gopal, Sourav Das, Partha Pratim Pande, Deukhyoun Heo:
A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC. IEEE Trans. Circuits Syst. 67-I(11): 3919-3932 (2020)

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