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"Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), ..."

Sebastian Micus et al. (2020)

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DOI: 10.3390/S20010005

access: open

type: Journal Article

metadata version: 2024-07-04

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  dblp key:
  - journals/sensors/MicusKHG20
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  - https://dblp.org/rec/journals/sensors/MicusKHG20
Sebastian Micus, Ivan Kirsten, Michael Haupt, Götz T. Gresser:
Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles. Sensors 20(1): 5 (2020)

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