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"Electromigration failure in a copper dual-damascene structure with a ..."

Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr (2012)

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DOI: 10.1016/J.MICROREL.2012.07.021

access: closed

type: Journal Article

metadata version: 2022-02-04

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Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr:
Electromigration failure in a copper dual-damascene structure with a through silicon via. Microelectron. Reliab. 52(9-10): 1981-1986 (2012)

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