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"Module grouping to reduce the area of test wrappers in SoCs."

Sangmin Kim, Youngsoo Shin (2018)

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DOI: 10.1016/J.VLSI.2017.09.006

access: closed

type: Journal Article

metadata version: 2020-02-20

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Sangmin Kim, Youngsoo Shin:
Module grouping to reduce the area of test wrappers in SoCs. Integr. 60: 39-47 (2018)

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