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"High-Throughput Hardware for 3D-HEVC Depth-Map Intra Prediction."

Mariana Ucker et al. (2020)

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DOI: 10.1109/MDAT.2019.2952344

access: closed

type: Journal Article

metadata version: 2020-07-15

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  - journals/dt/UckerASACSPZA20
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  - https://dblp.org/rec/journals/dt/UckerASACSPZA20
Mariana Ucker, Vladimir Afonso, Mário Saldanha, Luan Audibert, Ruhan A. Conceição, Altamiro Amadeu Susin, Marcelo Schiavon Porto, Bruno Zatt, Luciano Agostini:
High-Throughput Hardware for 3D-HEVC Depth-Map Intra Prediction. IEEE Des. Test 37(3): 7-14 (2020)

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