default search action

combined dblp search
author search
venue search
publication search

ask others

"Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating ..."

Tsung-Yen Liu et al. (2021)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2021.3111258

access: open

type: Journal Article

metadata version: 2021-11-03

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/LiuHLLCSL21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/LiuHLLCSL21
Tsung-Yen Liu, Shih-Ming Huang, Mu-Jen Lai, Rui-Sen Liu, Yi-Tsung Chang, Wen-Hong Sun, Ray-Ming Lin:
Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes. IEEE Access 9: 129874-129880 (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.