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"Virtual metrology for copper-clad laminate manufacturing."

Misuk Kim et al. (2017)

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DOI: 10.1016/J.CIE.2017.04.016

access: closed

type: Journal Article

metadata version: 2022-12-27

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  dblp key:
  - journals/candie/KimKLCCP17
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  - https://dblp.org/rec/journals/candie/KimKLCCP17
Misuk Kim, Seokho Kang, Jehyuk Lee, Hyunchang Cho, Sungzoon Cho, Jee Su Park:
Virtual metrology for copper-clad laminate manufacturing. Comput. Ind. Eng. 109: 280-287 (2017)

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