default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermal Aware Lifetime Reliability Optimization for Automotive Distributed ..."

Ajinkya S. Bankar et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ICCD50377.2020.00090

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/iccd/BankarSCQ20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iccd/BankarSCQ20
Ajinkya S. Bankar, Shi Sha, Vivek Chaturvedi, Gang Quan:
Thermal Aware Lifetime Reliability Optimization for Automotive Distributed Computing Applications. ICCD 2020: 498-505

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.