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"EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable ..."

S. Ghosh et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631364

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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  - conf/vlsit/GhoshKSSLDTGDPU24
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  - https://dblp.org/rec/conf/vlsit/GhoshKSSLDTGDPU24
S. Ghosh, A. Kruv, Quentin Smets, Tom Schram, D. J. Leech, T. Ding, V. Turkani, Benjamin Groven, A. Dangel, G. Probst, Thomas Uhrmann, Markus Wimplinger, Inge Asselberghs, Cesar J. Lockhart de la Rosa, Steven Brems, Gouri Sankar Kar:
EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration. VLSI Technology and Circuits 2024: 1-2

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