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"Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its ..."

Lan Peng et al. (2010)

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DOI: 10.1109/3DIC.2010.5751429

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/3dic/PengLLMLKT10
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Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan:
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 3DIC 2010: 1-5

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