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"Advanced TSV filling method with Sn alloy and its reliability."

Young-Ki Ko et al. (2011)

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DOI: 10.1109/3DIC.2012.6262988

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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  dblp key:
  - conf/3dic/KoKKSYL11
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  - https://dblp.org/rec/conf/3dic/KoKKSYL11
Young-Ki Ko, Myong-Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang-Woo Lee:
Advanced TSV filling method with Sn alloy and its reliability. 3DIC 2011: 1-4

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