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"Investigation of optimized high-density flip-chip interconnect design ..."

Katsuya Kikuchi et al. (2013)

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DOI: 10.1109/3DIC.2013.6702401

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

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  - https://dblp.org/rec/conf/3dic/KikuchiKNNAYK13
Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji:
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. 3DIC 2013: 1-4

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