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"Three-dimensional integrated circuits and stacked CMOS image sensors using ..."

Masahide Goto et al. (2015)

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DOI: 10.1109/3DIC.2015.7334562

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. 3DIC 2015: TS9.2.1-TS9.2.4

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