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"Impact of TSV integration on 14nm FinFET device performance."

Luke England et al. (2016)

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DOI: 10.1109/3DIC.2016.7970004

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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  dblp key:
  - conf/3dic/EnglandKAS16
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Luke England, Sukeshwar Kannan, Rahul Agarwal, Daniel Smith:
Impact of TSV integration on 14nm FinFET device performance. 3DIC 2016: 1-5

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