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Michael Zervas
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2020 – today
- 2024
- [c8]Manuel Kohli, Daniel Chelladurai, Laurenz Kulmer, Killian Keller, Yannik Horst, Tobias Blatter, Joel Winiger, David Moor, Tatiana Buriakova, Michael Zervas, Clarissa Convertino, Felix Eltes, Yuriy Fedoryshyn, Ueli Koch, Juerg Leuthold:
256 GBd Barium-Titanate-on-SiN Mach-Zehnder Modulator. OFC 2024: 1-3 - 2023
- [c7]Junyi Gao, Ta Ching Tzu, Tasneem Fatema, Xiangwen Guo, Qianhuan Yu, Gabriele Navickaite, Michael Zervas, Michael Geiselmann, Andreas Beling:
Heterogeneous balanced photodetector on silicon nitride with 30 GHz bandwidth and 26 dB common mode rejection ratio. OFC 2023: 1-3 - 2022
- [c6]Cosimo Calò, Kaoutar Benyahya, Haïk Mardoyan, Philippe Charbonnier, Davide Sacchetto, Michael Zervas, Karim Mekhazni, Delphine Lanteri, Harry Gariah, Catherine Fortin, Nicolas Vaissière, Antoine Elias, Olivier Parillaud, Franck Mallecot, Jean Decobert, Frédéric Pommereau, Jérémie Renaudier:
Hybrid InP-SiN microring-resonator based tunable laser with high output power and narrow linewidth for high capacity coherent systems. OFC 2022: 1-3 - 2020
- [c5]Qianhuan Yu, Junyi Gao, Nan Ye, Boheng Chen, Keye Sun, Linli Xie, Kartik Srinivasan, Michael Zervas, Gabriele Navickaite, Michael Geiselmann, Andreas Beling:
Heterogeneous Photodiodes on Silicon Nitride Waveguides with 20 GHz Bandwidth. OFC 2020: 1-3
2010 – 2019
- 2019
- [c4]Junqiu Liu, Arslan S. Raja, Maxim Karpov, Bahareh Ghadiani, Martin H. P. Pfeiffer, Anton Lukashchuk, Nils J. Engelsen, Hairun Guo, Michael Zervas, Tobias J. Kippenberg:
Ultralow-Power Chip-Based Soliton Microcombs for Photonic Integration. OFC 2019: 1-2 - 2018
- [c3]Junqiu Liu, Arslan S. Raja, Maxim Karpov
, Hairun Guo, Martin H. P. Pfeiffer, Bahareh Ghadiani, Michael Zervas, Tobias J. Kippenberg
Ultra-Low-Power Photonic Chip-Based Soliton Frequency Combs. ECOC 2018: 1-3 - 2013
- [c2]Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel:
Integration of intra chip stack fluidic cooling using thin-layer solder bonding. 3DIC 2013: 1-8 - 2012
- [j1]Giulia Beanato, Paolo Giovannini, Alessandro Cevrero, Panagiotis Athanasopoulos, Michael Zervas, Yuksel Temiz, Yusuf Leblebici:
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(2): 295-306 (2012) - 2011
- [c1]Hao Su
Real-time MRI-guided needle placement robot with integrated fiber optic force sensing. ICRA 2011: 1583-1588
Coauthor Index
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