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Yang Wan
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2020 – today
- 2024
- [j8]Zhaoyu Xing, Yang Wan, Juan Wen, Wei Zhong:
GOLFS: feature selection via combining both global and local information for high dimensional clustering. Comput. Stat. 39(5): 2651-2675 (2024) - 2023
- [j7]Jianxu Liu
, Yang Wan
Dynamic Correlation between the Chinese and the US Financial Markets: From Global Financial Crisis to COVID-19 Pandemic. Axioms 12(1): 14 (2023) - [j6]Yongping Zhang
Variable-Utility-Aware Manufacturing Service Collaboration Optimization Toward Industrial Internet Platforms. IEEE Trans. Syst. Man Cybern. Syst. 53(10): 6007-6017 (2023) - 2022
- [j5]Jia Liu, Fengshan Ma, Guang Li
Evolution Assessment of Mining Subsidence Characteristics Using SBAS and PS Interferometry in Sanshandao Gold Mine, China. Remote. Sens. 14(2): 290 (2022) - [j4]Guang Li
A Case Study on Ground Subsidence and Backfill Deformation Induced by Multi-Stage Filling Mining in a Steeply Inclined Ore Body. Remote. Sens. 14(18): 4555 (2022) - 2021
- [j3]Xinyu Tong
CSI Fingerprinting Localization With Low Human Efforts. IEEE/ACM Trans. Netw. 29(1): 372-385 (2021) - [i1]Yang Wan, Alice Lux-Fawzi, Haneesh Kesari:
Determining rigid body motion from accelerometer data through the square-root of a negative semi-definite tensor, with applications in mild traumatic brain injury. CoRR abs/2101.10405 (2021)
2010 – 2019
- 2019
- [j2]Yang Wan, Tianju Xue, Yongxing Shen
The successive node snapping scheme for an evolving branched curve in 2D and 3D. Comput. Aided Des. 111: 13-28 (2019) - [j1]Xinyu Tong, Fengyuan Zhu, Yang Wan, Xiaohua Tian, Xinbing Wang:
Batch Localization Based on OFDMA Backscatter. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 3(1): 25:1-25:25 (2019) - 2014
- [c4]Moongon Jung, Taigon Song, Yang Wan, Yarui Peng
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC 2014: 4:1-4:6 - 2013
- [c3]Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC 2013: 1-4 - [c2]Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. ICCAD 2013: 363-370 - 2011
- [c1]Jie Tang, Sen Wu, Bo Gao, Yang Wan:
Topic-level social network search. KDD 2011: 769-772
Coauthor Index
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last updated on 2024-10-07 22:23 CEST by the dblp team
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