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Jai Hyuk Song
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- affiliation: Samsung, Seoul, South Korea
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2020 – today
- 2022
- [c10]Jongmin Kim, Earl Kim, Jeongin Choe, Ki-Whan Song, Eun-Kyoung Kim, Jai Hyuk Song:
Machine Learning for Product Engineering in NAND Flash Memory. ICEIC 2022: 1-2 - [c9]Joonsung Lim, Soochan Chung, Dong-Hyeon Ko, Suk-Kang Sung, Kyungyoon Noh, Sujin Ahn, Jai Hyuk Song:
Development of 7th generation 3D VNAND Flash Product with COP structure for Growing Demand in Storage Market. ICEIC 2022: 1-4 - [c8]Wandong Kim, Dae-Seok Byeon, Sung-Min Joe, Jinyub Lee, Jai Hyuk Song:
Cell Operation Technologies to Overcome Scale-down Issues in 3D NAND Flash Memory. ICEIC 2022: 298-299 - [c7]Juwon Lee, Junho Seo, Jeonghun Nam, YongLae Kim, Ki-Whan Song, Jai Hyuk Song, Woo Young Choi:
Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory. IRPS 2022: 29-1 - [c6]Bu-Il Nam, Young-Ha Choi, Sungki Hong, Ki-Young Dong, Wontaeck Jung, Sang-Won Park, Soon-Yong Lee, Dooyeun Jung, Byoung-Hee Kim, Eun-Kyoung Kim, Ki-Whan Song, Jai Hyuk Song, Woo Young Choi:
Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory. IRPS 2022: 40-1 - [c5]Moosung Kim, Sung-Won Yun, Jungjune Park, Hyun Kook Park, Jungyu Lee, Yeong Seon Kim, Dae-Hoon Na, Sara Choi, Youngsun Song, Jonghoon Lee, Hyun-Jun Yoon, Kangbin Lee, Byunghoon Jeong, Sanglok Kim, Junhong Park, Cheon An Lee, Jaeyun Lee, Ji-Sang Lee, Jin Young Chun, Joonsuc Jang, Younghwi Yang, Seung Hyun Moon, Myung-Hoon Choi, Wontae Kim, Jungsoo Kim, Seok-Min Yoon, Pansuk Kwak, Myunghun Lee, Raehyun Song, Sunghoon Kim, Chiweon Yoon, Dongku Kang, Jin-Yub Lee, Jai Hyuk Song:
A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface. ISSCC 2022: 136-137 - 2021
- [j1]Dae-Hoon Na
, Jang-Woo Lee, Seon-Kyoo Lee
A 1.8-Gb/s/Pin 16-Tb NAND Flash Memory Multi-Chip Package With F-Chip for High-Performance and High-Capacity Storage. IEEE J. Solid State Circuits 56(4): 1129-1140 (2021) - [c4]Tongsung Kim, Anil Kavala, Hyunsuk Kang, Youngmin Jo, Jungjune Park, Kyoungtae Kang, Byung-Kwan Chun, Dong-Ho Shin, Dong-Su Jang, Byunghoon Jeong, Chiweon Yoon, Jinyub Lee, Jai Hyuk Song:
A Hybrid ZQ Calibration Design for High-Density Flash Memory Toggle 5.0 High-speed Interface. A-SSCC 2021: 1-2 - [c3]Chiweon Yoon, Hyunggon Kim, Seon-Kyoo Lee
Issues and Key Technologies for Next Generation 3D NAND. ICEIC 2021: 1-4 - [c2]Jiho Cho, D. Chris Kang, Jongyeol Park, Sangwan Nam, Jung-Ho Song, Bong-Kil Jung, Jaedoeg Lyu, Hogil Lee, Won-Tae Kim, Hongsoo Jeon, Sunghoon Kim, In-Mo Kim, Jae-Ick Son, Kyoungtae Kang, Sang-Won Shim, JongChul Park, Eungsuk Lee, Kyung-Min Kang, Sang-Won Park, Jaeyun Lee, Seung Hyun Moon, Pansuk Kwak, Byunghoon Jeong, Cheon An Lee, Kisung Kim, Junyoung Ko, Tae-Hong Kwon, Junha Lee, Yohan Lee, Chaehoon Kim, Myeong-Woo Lee, Jeong-Yun Yun, HoJun Lee, Yonghyuk Choi, Sanggi Hong, Jonghoon Park, Yoonsung Shin, Hojoon Kim, Hansol Kim, Chiweon Yoon, Dae-Seok Byeon, Seungjae Lee
A 512Gb 3b/Cell 7th -Generation 3D-NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface. ISSCC 2021: 426-428 - 2020
- [c1]Jang-Woo Lee, Dae-Hoon Na
A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems. VLSI Circuits 2020: 1-2
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