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Yun Chen 0002
Person information
- affiliation: Guangdong University of Technology, MOE, Key Laboratory of Mechanical Equipment Manufacturing and Control Technology, Guangzhou, China
- affiliation (PhD 2014): Central South University, Changsha, China
Other persons with the same name
- Yun Chen — disambiguation page
- Yun Chen 0001
— Fudan University, Department of Microelectronics, ASIC and System State Key Laboratory, Shanghai, China
- Yun Chen 0003
- Yun Chen 0004
- Yun Chen 0005
- Yun Chen 0006
- Yun Chen 0007
- Yun Chen 0008
- Yun Chen 0009 — Jiangsu University of Science and Technology, China (and 1 more)
- Yun Chen 0010
- Yun Chen 0011
- Yun Chen 0012
- Yun Chen 0013
- Yun Chen 0014
- Yun Chen 0015 — eBay Inc. (and 1 more)
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2020 – today
- 2024
- [j11]Lanyu Zhang, Shaoxuan Zhang, Jian Gao, Junhao Yi, Hao Wen, Yun Chen
Design and implementation of a precision levelling composite stage with active passive vibration isolation. Robotics Comput. Integr. Manuf. 89: 102744 (2024) - 2023
- [j10]Zhuojun Zheng
A Novel Defocus-Degree-Based Phase Unwrapping and Fusion Algorithm for High-Speed and Large-Depth-Range 3D Measurement. IEEE Trans. Ind. Electron. 70(4): 4278-4288 (2023) - [j9]Lanyu Zhang
A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding. IEEE Trans. Ind. Electron. 70(9): 9215-9226 (2023) - 2021
- [j8]Maoxiang Hou
Intensity Modulated Gas RI Sensor Based on Inornate Antiresonant Hollow-Core Fiber With Ultrahigh Sensitivity. IEEE Access 9: 45270-45276 (2021) - [j7]Lanyu Zhang
A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. IEEE Trans. Ind. Electron. 68(8): 7252-7262 (2021) - 2020
- [j6]Yun Chen
Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging. IEEE Access 8: 206571-206580 (2020)
2010 – 2019
- 2019
- [j5]Dongqing Wu
Triangular Model Registration Algorithm Through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition. IEEE Access 7: 34776-34790 (2019) - [j4]Yunbo He, Xiquan Mai
Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control. IEEE Access 7: 47143-47153 (2019) - 2018
- [j3]Xiuyang Shan
Experimental and modeling study on viscosity of encapsulant for electronic packaging. Microelectron. Reliab. 80: 42-46 (2018) - 2017
- [j2]Lanyu Zhang, Jian Gao, Xin Chen
A Rapid Vibration Reduction Method for Macro-Micro Composite Precision Positioning Stage. IEEE Trans. Ind. Electron. 64(1): 401-411 (2017) - [c1]Yunbo He, Chang Zhang, Wentao Ye, Zuoxiong He, Xin Chen
A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing. CIS/RAM 2017: 428-433 - 2016
- [j1]Mingliang Wang
Deep Learning-Based Model Reduction for Distributed Parameter Systems. IEEE Trans. Syst. Man Cybern. Syst. 46(12): 1664-1674 (2016)
Coauthor Index
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