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21st SLIP 2019: Las Vegas, NV, USA
- 21st ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2019, Las Vegas, NV, USA, June 1-2, 2019. IEEE 2019, ISBN 978-1-7281-2818-4
- Boris Vaisband, Subramanian S. Iyer:
Communication Considerations for Silicon Interconnect Fabric. 1-6 - Longfei Wang, Ragh Kuttappa, Baris Taskin, Selçuk Köse
:
Distributed Digital Low-Dropout Regulators with Phase Interleaving for On-Chip Voltage Noise Mitigation. 1-5 - Farid Kenarangi, Inna Partin-Vaisband:
Security Network On-Chip for Mitigating Side-Channel Attacks. 1-6 - Yiming Wen, Sayyed Farid Ahamed, Weize Yu:
A Novel PUF Architecture Against Non-Invasive Attacks. 1-5 - Chak-Wa Pui, Gang Wu, Freddy Y. C. Mang, Evangeline F. Y. Young:
An Analytical Approach for Time-Division Multiplexing Optimization in Multi-FPGA based Systems. 1-8 - Zheng Xu, Jacob Abraham:
FSNoC: Safe Network-on-Chip Design with Packet Level Lock Stepping. 1-6 - M. Ali Vosoughi, Longfei Wang, Selçuk Köse
Bus-Invert Coding as a Low-Power Countermeasure Against Correlation Power Analysis Attack. 1-5 - Dylan C. Stow, Itir Akgun, Yuan Xie:
Investigation of Cost-Optimal Network-on-Chip for Passive and Active Interposer Systems. 1-8
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