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"Health Assessment Method for Electronic Components Subject to Condition ..."

Shuai Zhao et al. (2019)

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DOI: 10.1109/TIM.2018.2839938

access: closed

type: Journal Article

metadata version: 2022-12-15

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  - https://dblp.org/rec/journals/tim/ZhaoMCL19
Shuai Zhao, Viliam Makis, Shaowei Chen, Yong Li:
Health Assessment Method for Electronic Components Subject to Condition Monitoring and Hard Failure. IEEE Trans. Instrum. Meas. 68(1): 138-150 (2019)

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