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"Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a ..."

Yung-Fa Chou et al. (2013)

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DOI: 10.1109/TCSI.2013.2246235

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/tcas/ChouKSW13
Yung-Fa Chou, Ding-Ming Kwai, Ming-Der Shieh, Cheng-Wen Wu:
Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs. IEEE Trans. Circuits Syst. I Regul. Pap. 60-I(9): 2343-2351 (2013)

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