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"Layer minimization of escape routing in area array packaging."

Renshen Wang, Rui Shi, Chung-Kuan Cheng (2006)

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DOI: 10.1145/1233501.1233668

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  dblp key:
  - conf/iccad/WangSC06
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/WangSC06
Renshen Wang, Rui Shi, Chung-Kuan Cheng:
Layer minimization of escape routing in area array packaging. ICCAD 2006: 815-819

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