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"Copper Coin Over Thermal VIA in PCB for Thermal Management of 12W."

Marcus Miguel V. Vicedo, Febus Reidj G. Cruz, Ramon G. Garcia (2020)

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DOI: 10.1109/APCCAS50809.2020.9301674

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-27

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  - conf/apccas/VicedoCG20
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  - https://dblp.org/rec/conf/apccas/VicedoCG20
Marcus Miguel V. Vicedo, Febus Reidj G. Cruz, Ramon G. Garcia:
Copper Coin Over Thermal VIA in PCB for Thermal Management of 12W. APCCAS 2020: 169-172

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