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"Discussion on the lapping and polishing process of 4H-SiC wafer."

Wei Cheng et al. (2013)

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DOI: 10.1109/NEMS.2013.6559856

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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  dblp key:
  - conf/nems/ChengYLZZWS13
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  - https://dblp.org/rec/conf/nems/ChengYLZZWS13
Wei Cheng, Yugang Yin, Yipan Li, Haoer Zhang, Shiming Zhang, Lingyun Wang, Daoheng Sun:
Discussion on the lapping and polishing process of 4H-SiC wafer. NEMS 2013: 841-844

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