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Proceedings of the IEEE, Volume 112

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Volume 112, Number 1, January 2024

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Julian Togelius, Georgios N. Yannakakis:
Choose Your Weapon: Survival Strategies for Depressed AI Academics [Point of View]. 4-11
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Shuiguang Deng, Hailiang Zhao, Binbin Huang, Cheng Zhang, Feiyi Chen, Yinuo Deng, Jianwei Yin, Schahram Dustdar, Albert Y. Zomaya:
Cloud-Native Computing: A Survey From the Perspective of Services. 12-46
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Yu'e Jiang, Liangmin Wang, Hsiao-Hwa Chen, Xuemin Shen:
Physical Layer Covert Communication in B5G Wireless Networks - its Research, Applications, and Challenges. 47-82

Volume 112, Number 2, February 2024

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Justin Dulay, Sonia Poltoratski, Till S. Hartmann, Samuel E. Anthony, Walter J. Scheirer:
Informing Machine Perception With Psychophysics. 88-96
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He Zhang, Bang Wu, Xingliang Yuan, Shirui Pan, Hanghang Tong, Jian Pei:
Trustworthy Graph Neural Networks: Aspects, Methods, and Trends. 97-139
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Daniel Bonilla Licea, Mounir Ghogho, Martin Saska:
When Robotics Meets Wireless Communications: An Introductory Tutorial. 140-177

Volume 112, Number 3, March 2024

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Chao Gong, Yunwei Ryan Li, Navid Reza Zargari:
An Overview of Advancements in Multimotor Drives: Structural Diversity, Advanced Control, Specific Technical Challenges, and Solutions. 184-209
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Theodore Tangie Longtchi, Rosana Montañez Rodriguez, Laith Al-Shawaf, Adham Atyabi, Shouhuai Xu:
Internet-Based Social Engineering Psychology, Attacks, and Defenses: A Survey. 210-246
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Badr Bellaj, Aafaf Ouaddah, Emmanuel Bertin, Noël Crespi, Abdellatif Mezrioui:
Drawing the Boundaries Between Blockchain and Blockchain-Like Systems: A Comprehensive Survey on Distributed Ledger Technologies. 247-299

Volume 112, Number 4, April 2024

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Laura Londoño, Juana Valeria Hurtado, Nora Hertz, Philipp Kellmeyer, Silja Voeneky, Abhinav Valada:
Fairness and Bias in Robot Learning. 305-330
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Enyu Shi, Jiayi Zhang, Hongyang Du, Bo Ai, Chau Yuen, Dusit Niyato, Khaled B. Letaief, Xuemin Shen:
RIS-Aided Cell-Free Massive MIMO Systems for 6G: Fundamentals, System Design, and Applications. 331-364
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Hao Huang, H. Vincent Poor, Katherine R. Davis, Thomas J. Overbye, Astrid Layton, Ana E. Goulart, Saman A. Zonouz:
Toward Resilient Modern Power Systems: From Single-Domain to Cross-Domain Resilience Enhancement. 365-398

Volume 112, Number 5, May 2024

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Ashutosh Sabharwal, Besma Smida:
In-Band Full Duplex. 402-404
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Aravind Nagulu, Negar Reiskarimian, Tingjun Chen, Sasank Garikapati, Igor Kadota, Tolga Dinc, Sastry Garimella, Manav Kohli, Alon Simon Levin, Gil Zussman, Harish Krishnaswamy:
Doubling Down on Wireless Capacity: A Review of Integrated Circuits, Systems, and Networks for Full Duplex. 405-432
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Besma Smida, Risto Wichman, Kenneth E. Kolodziej, Himal A. Suraweera, Taneli Riihonen, Ashutosh Sabharwal:
In-Band Full-Duplex: The Physical Layer. 433-462
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Yonghwi Kim, Hyung-Joo Moon, Hanju Yoo, Byoungnam Kim, Kai-Kit Wong, Chan-Byoung Chae:
A State-of-the-Art Survey on Full-Duplex Network Design. 463-486
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Muhammad Abdelghaffar, Thomas Valerrian Pasca Santhappan, Yeliz Tokgoz, Kiran Mukkavilli, Tingfang Ji:
Subband Full-Duplex Large-Scale Deployed Network Designs and Tradeoffs. 487-510

Volume 112, Number 6, June 2024

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Maxime Fontana, Michael W. Spratling, Miaojing Shi:
When Multitask Learning Meets Partial Supervision: A Computer Vision Review. 516-543
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Guoqi Li, Lei Deng, Huajin Tang, Gang Pan, Yonghong Tian, Kaushik Roy, Wolfgang Maass:
Brain-Inspired Computing: A Systematic Survey and Future Trends. 544-584
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Nathan J. Kong, J. Joe Payne, James Zhu, Aaron M. Johnson:
Saltation Matrices: The Essential Tool for Linearizing Hybrid Dynamical Systems. 585-608

Volume 112, Number 7, July 2024

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Mohamed-Slim Alouini, Emil Björnson, Meixia Tao, Yasamin Mostofi:
The Road to 6G: Driving the Next Wave of Connectivity - Part I. 615-620
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Zhijin Qin, Le Liang, Zijing Wang, Shi Jin, Xiaoming Tao, Wen Tong, Geoffrey Ye Li:
AI Empowered Wireless Communications: From Bits to Semantics. 621-652
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Sisi Miao, Claus Kestel, Lucas Johannsen, Marvin Geiselhart, Laurent Schmalen, Alexios Balatsoukas-Stimming, Gianluigi Liva, Norbert Wehn, Stephan ten Brink:
Trends in Channel Coding for 6G. 653-675
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Nuria González Prelcic, Musa Furkan Keskin, Ossi Kaltiokallio, Mikko Valkama, Davide Dardari, Xiao Shen, Yuan Shen, Murat Bayraktar, Henk Wymeersch:
The Integrated Sensing and Communication Revolution for 6G: Vision, Techniques, and Applications. 676-723
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Qingqing Wu, Beixiong Zheng, Changsheng You, Lipeng Zhu, Kaiming Shen, Xiaodan Shao, Weidong Mei, Boya Di, Hongliang Zhang, Ertugrul Basar, Lingyang Song, Marco Di Renzo, Zhi-Quan Luo, Rui Zhang:
Intelligent Surfaces Empowered Wireless Network: Recent Advances and the Road to 6G. 724-763
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Constantinos Psomas, Konstantinos Ntougias, Nikita Shanin, Dongfang Xu, Kenneth MacSporran Mayer, Nguyen Minh Tran, Laura Cottatellucci, Kae Won Choi, Dong In Kim, Robert Schober, Ioannis Krikidis:
Wireless Information and Energy Transfer in the Era of 6G Communications. 764-804
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Hien Quoc Ngo, Giovanni Interdonato, Erik G. Larsson, Giuseppe Caire, Jeffrey G. Andrews:
Ultradense Cell-Free Massive MIMO for 6G: Technical Overview and Open Questions. 805-831
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Bruno Clerckx, Yijie Mao, Zhaohui Yang, Mingzhe Chen, Ahmed Alkhateeb, Liang Liu, Min Qiu, Jinhong Yuan, Vincent W. S. Wong, Juan Montojo:
Multiple Access Techniques for Intelligent and Multifunctional 6G: Tutorial, Survey, and Outlook. 832-879
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Yuyi Mao, Xianghao Yu, Kaibin Huang, Ying-Jun Angela Zhang, Jun Zhang:
Green Edge AI: A Contemporary Survey. 880-911
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Muhammad Ali Imran, Marco Zennaro, Olaoluwa R. Popoola, Luca Chiaraviglio, Hongwei Zhang, Pietro Manzoni, Jaap van de Beek, Robert Stewart, Mitchell A. Cox, Luciano Leonel Mendes, Ermanno Pietrosemoli:
Exploring the Boundaries of Connected Systems: Communications for Hard-to-Reach Areas and Extreme Conditions. 912-945

Volume 112, Number 8, August 2024

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Yang Yang, Manos M. Tentzeris:
Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing. 950-953
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Yang Yang, Zhiwei Yin, Xuyi Zhu, Hani Al Jamal, Xiaojing Lv, Kexin Hu, Marvin Joshi, Nathan Wille, Mengze Li, Bing Zhang, Zhen Luo, Shlomo Magdassi, Manos M. Tentzeris:
A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation. 954-999
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Eiyong Park, Minjae Lee, Heijun Jeong, Ratanak Phon, Kyounghwan Kim, Seyeon Park, Sungjoon Lim:
3-D/4-D-Printed Reconfigurable Metasurfaces for Controlling Electromagnetic Waves. 1000-1032
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Geng-Bo Wu, Jin Chen, Chenfeng Yang, Ka Fai Chan, Mu Ku Chen, Din Ping Tsai, Chi Hou Chan:
3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications. 1033-1050
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Hervé Aubert, Dominique Henry, Patrick Pons:
3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave Components. 1051-1064
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Valentina Palazzi, Federico Alimenti, Leonardo Pierantozzi, Matteo Ribeca, Leonardo Balocchi, Luca Valentini, Silvia Bittolo Bon, Paolo Mezzanotte, Manos M. Tentzeris, Luca Roselli:
Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing. 1065-1090

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