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"Compact Lateral Thermal Resistance Model of TSVs for Fast ..."

Zao Liu et al. (2014)

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DOI: 10.1109/TCAD.2014.2334321

access: closed

type: Journal Article

metadata version: 2020-09-24

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Zao Liu, Sahana Swarup, Sheldon X.-D. Tan, Hai-Bao Chen, Hai Wang:
Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(10): 1490-1502 (2014)

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