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"Measurement of thermal resistance of first-level Cu substrate used in ..."

C. T. Yang, W. C. Liu, C. Y. Liu (2012)

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DOI: 10.1016/J.MICROREL.2011.05.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. T. Yang, W. C. Liu, C. Y. Liu:
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package. Microelectron. Reliab. 52(5): 855-860 (2012)

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