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"Chip-Package Interaction in 3D stacked IC packages using Finite Element ..."

Bart Vandevelde et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.026

access: closed

type: Journal Article

metadata version: 2024-08-04

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Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei:
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54(6-7): 1200-1205 (2014)

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