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"3D heterogeneous integration enabling future RF ICs."

Qi Chen et al. (2018)

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DOI: 10.1109/RWS.2018.8304982

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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Qi Chen, Chenkun Wang, Feilong Zhang, Cheng Li, Albert Z. Wang:
3D heterogeneous integration enabling future RF ICs. RWS 2018: 188-190

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