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"Delay testing and characterization of post-bond interposer wires in 2.5-D ICs."

Shi-Yu Huang et al. (2013)

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DOI: 10.1109/TEST.2013.6651906

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  dblp key:
  - conf/itc/HuangHTC13
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  persistent URL:
  - https://dblp.org/rec/conf/itc/HuangHTC13
Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng:
Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. ITC 2013: 1-8

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