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"Study of a new electromigration failure mechanism by novel test structure."

L. D. Chen et al. (2015)

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DOI: 10.1109/IRPS.2015.7112684

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/irps/ChenLHCTPCL15
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  - https://dblp.org/rec/conf/irps/ChenLHCTPCL15
L. D. Chen, B. L. Lin, M.-H. Hsieh, C. W. Chang, J. S. Tsai, J. C. Peng, C. C. Chiu, Y.-H. Lee:
Study of a new electromigration failure mechanism by novel test structure. IRPS 2015: 2

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